Inventor · disambiguated record
Jhih-Wei Lai
Also filed as: LAI JHIH-WEI
2 granted patents·14 pending applications·0 citations·filing 2022–2024
22Inventor score
Files withTONG HSING ELECTRONIC INDUSTRIES LTD16
Top patents by PatentIndex Score
16 records- 0162US2025253608A1Multi-layer composite heat dissipation substrateTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 0258US2025142730A1Power component submount and manufacturing method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 0353US2024365473A1Method for manufacturing conductive circuit board and conductive circuit board made therefromTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 0453US2025074830A1Ceramic substrate and method for manufacturing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 0552US2025351265A1High reliability ceramic circuit board and method for producing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 0651US2025107299A1Light emitting diode package structure and method for manufacturing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 0750US2024360043A1Composite ceramic substrate having multi-layer configurationTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 0848US2024304461A1Ceramic submount for semiconductor device and method for manufacturing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 0948US2024363482A1Ceramic metal composite substrateTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 1046US12432852B2Circuit board structure with embedded ceramic substrate and manufacturing process thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Sep 30, 2025·0 cites·10 claims
- 1144US12500092B2Chip package structure and method for fabricating the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2022·Granted Dec 16, 2025·0 cites·7 claims
- 1243US2024284592A1Printed circuit board and method for making the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 1343US2024363479A1Ceramic metal composite substrateTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 1443US2024276650A1Circuit board and manufacturing method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 1541US2024088049A1Chip package structure and method for fabricating the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 1641US2024032204A1Method for manufacturing conductive circuit board and conductive circuit board made therefromTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →