Inventor · disambiguated record
Jheng-Wei Lin
Also filed as: LIN JHENG-WEI
1 granted patent·3 pending applications·0 citations·filing 2022–2025
13Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD4
Top patents by PatentIndex Score
4 records- 0175US2025366076A1Stress liners in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0266US12249539B2Multigate device structure with engineered cladding and method making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 11, 2025·0 cites·20 claims
- 0364US2025022956A1Stress liners in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0463US2025266290A1Multigate Device Structure with Engineered Cladding and Method Making the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Jheng-Wei Lin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →