Inventor · disambiguated record
Jin-Hee Bae
Also filed as: BAE JIN-HEE
25 granted patents·15 pending applications·22 citations·filing 2003–2024
91Inventor score
Top patents by PatentIndex Score
40 records- 0185US8058711B2Filler for filling a gap and method for manufacturing semiconductor capacitor using the sameLIM SANG-HAK·Filed 2010·Granted Nov 15, 2011·10 cites·18 claims
- 0278US8299197B2Organosilane polymer with improved gap-filling property for semiconductor device and coating composition using the sameWOO CHANG SOO·Filed 2010·Granted Oct 30, 2012·3 cites·11 claims
- 0375US10093830B2Composition for forming a silica based layer, method for manufacturing silica based layer, and electronic device including the silica based layerSAMSUNG SDI CO LTD·Filed 2015·Granted Oct 9, 2018·1 cites·13 claims
- 0472US9082612B2Composition for forming a silica layer, method of manufacturing the composition, silica layer prepared using the composition, and method of manufacturing the silica layerYUN HUI-CHAN·Filed 2011·Granted Jul 14, 2015·4 cites·13 claims
- 0571US10106687B2Composition for forming silica layer, method for manufacturing silica layer and silica layerSAMSUNG SDI CO LTD·Filed 2016·Granted Oct 23, 2018·1 cites·12 claims
- 0671US9096726B2Composition for forming silica based insulating layer, method for manufacturing composition for forming silica based insulating layer, silica based insulating layer and method for manufacturing silica based insulating layerLIM SANG-HAK·Filed 2011·Granted Aug 4, 2015·3 cites·10 claims
- 0768US2025123568A1Composition for removing edge bead from metal containing resists, developer composition of metal containing resists, and method of forming patterns using the compositionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 0868US2025224682A1Composition for removing edge bead from metal containing resists, developer composition of metal containing resists and method of forming patterns using the compositionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 0967US12461558B2Display deviceSAMSUNG DISPLAY CO LTD·Filed 2023·Granted Nov 4, 2025·0 cites·19 claims
- 1065US2024393694A1Metal containing photoresist developer composition, and method of forming patterns including step of developing using the compositionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 1165US2025044696A1Composition for removing edge bead from metal containing resists, developer composition of metal containing resists, and method of forming patterns using the compositionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 1264US2025017081A1Display device and method for manufacturing the sameSAMSUNG DISPLAY CO LTD·Filed 2024·Application pending·0 cites
- 1363US2024393684A1Method of forming patternsSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 1463US2024393698A1Composition for removing edge beads from metal-containing resists, developer composition of metal-containing resists, and method of forming patterns using the compositionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 1562US2024358853A1Use of mecp2 as biomarker for depression diagnosis and depression treatment targetKOREA INST SCI & TECH·Filed 2024·Application pending·0 cites
- 1661US2025230355A1Composition for removing edge bead from metal containing resists, developer composition of metal containing resists, and method of forming patterns using the compositionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 1756US2024385522A1Composition for removing edge beads from metal containing resists, and method of forming patterns including step of removing edge beads utilizing the composition, and a system of forming patternsSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 1854US8383737B2Compound for gap-filling of semiconductor device and coating composition using the sameCHEIL IND INC·Filed 2007·Granted Feb 26, 2013·0 cites·18 claims
- 1954US2015093545A1Composition for a silica based layer, silica based layer, and method of manufacturing a silica based layerSAMSUNG SDI CO LTD·Filed 2014·Application pending·0 cites
- 2051US2024019784A1Metal containing photoresist developer composition, and method of forming patterns including step of developing using the compositionSAMSUNG SDI CO LTD·Filed 2023·Application pending·0 cites
- 2150US9738787B2Composition for forming silica-based insulating layer, method for preparing composition for forming silica-based insulating layer, silica-based insulating layer, and method for manufacturing silica-based insulating layerCHEIL IND INC·Filed 2013·Granted Aug 22, 2017·0 cites·9 claims
- 2250US2004033276A1Coating composition for cereals having a preventive or treating effect on diabetes and cereals coated therebyFiled 2003·Application pending·0 cites
- 2348US11852930B2Display deviceSAMSUNG DISPLAY CO LTD·Filed 2020·Granted Dec 26, 2023·0 cites·20 claims
- 2448US9890255B2Modified hydrogenated polysiloxazane, composition comprising same for forming silica-based insulation layer, method for preparing composition for formingCHEIL IND INC·Filed 2013·Granted Feb 13, 2018·0 cites·19 claims
- 2546US9902873B2Composition for forming silica based layer, and method for manufacturing silica based layerSAMSUNG SDI CO LTD·Filed 2014·Granted Feb 27, 2018·0 cites·10 claims
- 2644US10427944B2Composition for forming a silica based layer, silica based layer, and electronic deviceSAMSUNG SDI CO LTD·Filed 2015·Granted Oct 1, 2019·0 cites·16 claims
- 2743US12264075B2Composition for forming silica layer and silica layerSAMSUNG SDI CO LTD·Filed 2020·Granted Apr 1, 2025·0 cites·16 claims
- 2843US11201052B2Composition for forming silica layer, silica layer and electronic device incorporating silica layerSAMSUNG SDI CO LTD·Filed 2020·Granted Dec 14, 2021·0 cites·13 claims
- 2942US10804095B2Composition for forming silica layer, silica layer, and electronic deviceSAMSUNG SDI CO LTD·Filed 2018·Granted Oct 13, 2020·0 cites·16 claims
- 3042US9957418B2Composition for forming silica layer, method for manufacturing silica layer, and silica layerSAMSUNG SDI CO LTD·Filed 2015·Granted May 1, 2018·0 cites·17 claims
- 3142US9721785B2Method for manufacturing silica layer, silica layer, and electronic deviceSAMSUNG SDI CO LTD·Filed 2016·Granted Aug 1, 2017·0 cites·11 claims
- 3241US10017646B2Composition for forming silica layer, method for manufacturing silica layer, and electric device including silica layerSAMSUNG SDI CO LTD·Filed 2017·Granted Jul 10, 2018·0 cites·8 claims
- 3341US8766411B2Filler for filling a gap, method of preparing the same and method of manufacturing semiconductor capacitor using the samePARK EUN-SU·Filed 2012·Granted Jul 1, 2014·0 cites·8 claims
- 3440US10153171B2Method of forming patterns, patterns formed according to the method, and semiconductor device including the patternsSAMSUNG SDI CO LTD·Filed 2017·Granted Dec 11, 2018·0 cites·11 claims
- 3540US2014346391A1Polysiloxane hydroxide thin-film rinse solution, and polysilooxazine hydroxide thin-film pattern-forming method using the sameCHEIL IND INC·Filed 2012·Application pending·0 cites
- 3639US10020185B2Composition for forming silica layer, silica layer, and electronic deviceSAMSUNG SDI CO LTD·Filed 2015·Granted Jul 10, 2018·0 cites·16 claims
- 3739US2021324235A1Composition for forming silica layer, silica layer formed therefrom, and electronic device including silica layerSAMSUNG SDI CO LTD·Filed 2021·Application pending·0 cites
- 3837US9240443B2Process of preparing a gap filler agent, a gap filler agent prepared using same, and a method for manufacturing semiconductor capacitor using the gap filler agentBAE JIN-HEE·Filed 2013·Granted Jan 19, 2016·0 cites·16 claims
- 3936US9312122B2Rinse liquid for insulating film and method of rinsing insulating filmBAE JIN-HEE·Filed 2013·Granted Apr 12, 2016·0 cites·11 claims
- 4034US11518909B2Composition for forming silica layer, manufacturing method for silica layer, and silica layerSAMSUNG SDI CO LTD·Filed 2018·Granted Dec 6, 2022·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →