Inventor · disambiguated record
Jinhye Bae
Also filed as: BAE JINHYE
9 granted patents·4 pending applications·16 citations·filing 2012–2024
82Inventor score
Top patents by PatentIndex Score
13 records- 0181US9735351B2Magneto-resistance random access memory device and method of manufacturing the sameLEE WONJUN·Filed 2016·Granted Aug 15, 2017·5 cites·20 claims
- 0279US9660186B2Method of inspecting by-products and method of manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 23, 2017·3 cites·20 claims
- 0377US11380537B2Method of manufacturing a semiconductor device and a cleaning composition for an adhesive layerSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 5, 2022·2 cites·8 claims
- 0476US12360457B2Compositions for removing photoresists and methods of manufacturing semiconductor devices and semiconductor packages using the compositionsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 0574US8853660B2Semiconductor memory devices having lower and upper interconnections, selection components and memory componentsSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Oct 7, 2014·4 cites·14 claims
- 0668US10038136B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 31, 2018·1 cites·2 claims
- 0766US12044974B2Compositions for removing photoresists and methods of manufacturing semiconductor devices and semiconductor packages using the compositionsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 23, 2024·0 cites·20 claims
- 0861US2025129288A1Etching composition, method of etching metal-containing film by using the same, and method of manufacturing semiconductor device by using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0957US9525128B2Semiconductor devices and methods of manufacturing the sameCHUNG SUNGYOON·Filed 2014·Granted Dec 20, 2016·1 cites·18 claims
- 1054US10332740B2Method of manufacturing a semiconductor device and a cleaning composition for an adhesive layerSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 25, 2019·0 cites·15 claims
- 1152US2024309298A1Stripper compositionSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1251US2025282994A1Etching compositions, methods of treating substrates using the same, and methods of manufacturing integrated circuit devices using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1351US2025277149A1Etching composition and method for manufacturing semiconductor device using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Jinhye Bae files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →