Inventor · disambiguated record
Jianshe Bi
Also filed as: BI JIANSHE
3 granted patents·4 citations·filing 2012–2015
55Inventor score
Top patents by PatentIndex Score
3 records- 0174US9362212B1Integrated circuit package having side and bottom contact padsFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Jun 7, 2016·3 cites·17 claims
- 0249US9196557B1Protective packaging for integrated circuit deviceBI JIANSHE·Filed 2014·Granted Nov 24, 2015·1 cites·5 claims
- 0337US8859086B2Bonded structure of touch screen with flexible circuit board for preventing overflow and bonding method thereofYI XIN·Filed 2012·Granted Oct 14, 2014·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →