Inventor · disambiguated record
Jin-Chyuan Biar
Also filed as: BIAR JIN-CHYUAN
3 granted patents·2 pending applications·40 citations·filing 1997–2008
70Inventor score
Top patents by PatentIndex Score
5 records- 0170US6190943B1Chip scale packaging methodUNITED TEST CT INC·Filed 2000·Granted Feb 20, 2001·26 cites·3 claims
- 0257US7737452B2Light-emitting element package and light source apparatus using the sameBIAR JIN-CHYUAN·Filed 2007·Granted Jun 15, 2010·4 cites·37 claims
- 0343US2008265356A1Chip size image sensing chip packageBIAR JIN-CHYUAN·Filed 2008·Application pending·0 cites
- 0443US2008265388A1Ultra thin image sensing chip packageBIAR JIN-CHYUAN·Filed 2008·Application pending·0 cites
- 0538US6221689B1Method for improving the reliability of underfill process for a chipAPACK TECHNOLOGIES INC·Filed 1997·Granted Apr 24, 2001·10 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →