Inventor · disambiguated record
Jimmy C. Black
Also filed as: BLACK JIMMY C
8 granted patents·196 citations·filing 1985–1991
88Inventor score
Top patents by PatentIndex Score
8 records- 0181US4624749AElectrodeposition of submicrometer metallic interconnect for integrated circuitsHARRIS CORP·Filed 1985·Granted Nov 25, 1986·63 cites·20 claims
- 0276US4702967AMultiple-layer, multiple-phase titanium/nitrogen adhesion/diffusion barrier layer structure for gold-base microcircuit interconnectionHARRIS CORP·Filed 1986·Granted Oct 27, 1987·49 cites·16 claims
- 0362US4753851AMultiple layer, tungsten/titanium/titanium nitride adhesion/diffusion barrier layer structure for gold-base microcircuit interconnectionHARRIS·Filed 1987·Granted Jun 28, 1988·33 cites·17 claims
- 0449US5034789ADielectric isolation for SOI island side wall for reducing leakage currentHARRIS CORP·Filed 1988·Granted Jul 23, 1991·18 cites·13 claims
- 0541US4716071AMethod of ensuring adhesion of chemically vapor deposited oxide to gold integrated circuit interconnect linesHARRIS CORP·Filed 1985·Granted Dec 29, 1987·11 cites·9 claims
- 0640US4713260AMethod of ensuring adhesion of chemically vapor deposited oxide to gold integrated circuit interconnect linesHARRIS CORP·Filed 1987·Granted Dec 15, 1987·10 cites·13 claims
- 0732US5053353AFabricating dielectric isolation of SOI island side wall for reducing leakage currentHARRIS CORP·Filed 1991·Granted Oct 1, 1991·6 cites·10 claims
- 0829US4970573ASelf-planarized gold interconnect layerHARRIS CORP·Filed 1988·Granted Nov 13, 1990·6 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →