Inventor · disambiguated record
Jian Cai
Also filed as: CAI JIAN · Cai jian-feng
5 granted patents·4 pending applications·3 citations·filing 2011–2024
63Inventor score
Files withUNIV TSINGHUA3CAI JIAN2BOE TECHNOLOGY GROUP CO LTD1CHINA TEXTILE ACADEMY1OHIO STATE INNOVATION FOUNDATION1
Top patents by PatentIndex Score
9 records- 0174US11124899B2Method for preparing cellulose fiberCHINA TEXTILE ACADEMY·Filed 2016·Granted Sep 21, 2021·1 cites·13 claims
- 0263US9613925B2Method for bonding semiconductor devices on sustrate and bonding structure formed using the sameUNIV TSINGHUA·Filed 2014·Granted Apr 4, 2017·2 cites·18 claims
- 0356US2025158851A1Method and apparatus of channel estimation in ultra-wideband communicationOHIO STATE INNOVATION FOUNDATION·Filed 2024·Application pending·0 cites
- 0451US2022081788A1General method for the synthesis of FeCoNiCu-based high-entropy alloy and their application for electrocatalytic water splittingUNIV JIANGNAN·Filed 2021·Application pending·0 cites
- 0545US9960093B2Packaging structure, packaging method and template used in packaging methodUNIV TSINGHUA·Filed 2014·Granted May 1, 2018·0 cites·2 claims
- 0640US11941209B2Touch module, preparation method therefor, and display deviceBOE TECHNOLOGY GROUP CO LTD·Filed 2021·Granted Mar 26, 2024·0 cites·9 claims
- 0736US9258894B2Bolometer and preparation method thereofCAI JIAN·Filed 2012·Granted Feb 9, 2016·0 cites·10 claims
- 0833US2017323849A1Adapter panel and manufacturing method and encapsulation structure thereof and bonding method for the adapter panelUNIV TSINGHUA·Filed 2015·Application pending·0 cites
- 0932US2015115437A1Universal encapsulation substrate, encapsulation structure and encapsulation methodCAI JIAN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →