Inventor · disambiguated record
Jiun-Ruey Chen
Also filed as: CHEN JIUN-RUEY
4 granted patents·7 pending applications·12 citations·filing 2020–2024
67Inventor score
Files withINTEL CORP11
Top patents by PatentIndex Score
11 records- 0198US11444024B2Subtractively patterned interconnect structures for integrated circuitsINTEL CORP·Filed 2020·Granted Sep 13, 2022·10 cites·30 claims
- 0295US12027458B2Subtractively patterned interconnect structures for integrated circuitsINTEL CORP·Filed 2022·Granted Jul 2, 2024·2 cites·20 claims
- 0383US12482744B2Subtractively patterned interconnect structures for integrated circuitsINTEL CORP·Filed 2024·Granted Nov 25, 2025·0 cites·19 claims
- 0463US2025393189A1Capacitors with amorphous oxide layer for high capacitance and low leakageINTEL CORP·Filed 2024·Application pending·0 cites
- 0557US2025218868A1Self-aligned interconnect features with floating dielectric structureINTEL CORP·Filed 2023·Application pending·0 cites
- 0657US2025112155A1Conformal coatings with spatially defined surface energies for die-to-wafer self-alignment assisted assemblyINTEL CORP·Filed 2023·Application pending·0 cites
- 0755US2025379149A1Selective conductive cap and liner deposition techniques for interconnects and contact structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 0854US12500162B2Staggered vertically spaced integrated circuit line metallization with differential vias and metal-selective depositionINTEL CORP·Filed 2021·Granted Dec 16, 2025·0 cites·12 claims
- 0952US2023420510A1Self-assembled monolayer on a dielectric for transition metal dichalcogenide growth for stacked 2d channelsINTEL CORP·Filed 2022·Application pending·0 cites
- 1051US2023197836A1Integrated circuits with max or mx conductive materialsINTEL CORP·Filed 2021·Application pending·0 cites
- 1144US2022139772A1Interconnect structures with area selective adhesion or barrier materials for low resistance vias in integrated circuitsINTEL CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →