Inventor · disambiguated record
Jie Chen
Also filed as: CHEN JIE · CHEN JIE P · CHEN JIE-FU
393 granted patents·124 pending applications·2,716 citations·filing 1993–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD217INNOGRIT TECHNOLOGIES CO LTD49TEXAS INSTRUMENTS INC23CHEN JIE15HESAI TECHNOLOGY CO LTD12
Top patents by PatentIndex Score
517 records- 0199US11482649B2Semiconductor package and manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 25, 2022·9 cites·20 claims
- 0299US11362065B2Package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 14, 2022·8 cites·14 claims
- 0399US11145622B2Discrete polymer in fan-out packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 12, 2021·5 cites·20 claims
- 0499US11146290B1Bit-flipping method for decoding LDPC code and system using the sameINNOGRIT TECHNOLOGIES CO LTD·Filed 2020·Granted Oct 12, 2021·28 cites·18 claims
- 0599US10504852B1Three-dimensional integrated circuit structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·45 cites·19 claims
- 0699US10037963B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 31, 2018·56 cites·20 claims
- 0799US9768133B1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 19, 2017·45 cites·20 claims
- 0899US9666502B2Discrete polymer in fan-out packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 30, 2017·684 cites·20 claims
- 0998US12261163B2Molded dies in semiconductor packages and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 25, 2025·4 cites·18 claims
- 1098US11908692B2Method for fabricating a chip packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·4 cites·20 claims
- 1198US11362069B2Three-dimensional stacking structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 14, 2022·4 cites·20 claims
- 1298US11342297B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·4 cites·20 claims
- 1398US11264343B2Bond pad structure for semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 1, 2022·5 cites·20 claims
- 1498US9589903B2Eliminate sawing-induced peeling through forming trenchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 7, 2017·20 cites·20 claims
- 1598US9461025B2Electric magnetic shielding structure in packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 4, 2016·48 cites·20 claims
- 1698US9318452B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 19, 2016·48 cites·18 claims
- 1797US12205856B2Semiconductor structure including interconnection to probe pad with probe markTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 21, 2025·2 cites·20 claims
- 1897US11960127B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 16, 2024·2 cites·20 claims
- 1997US11664336B2Bonding structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 30, 2023·3 cites·20 claims
- 2097US11557581B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 17, 2023·4 cites·20 claims
- 2197US11309291B2Die stack structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 19, 2022·3 cites·20 claims
- 2297US10629560B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 21, 2020·12 cites·20 claims
- 2396US11798931B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 24, 2023·2 cites·20 claims
- 2496US11756907B2Bonding structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·2 cites·20 claims
- 2596US11410948B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 9, 2022·3 cites·20 claims
- 2696US11309243B2Package having different metal densities in different regions and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 19, 2022·3 cites·20 claims
- 2796US11257791B2Stacked die structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 22, 2022·3 cites·20 claims
- 2896US11200190B2Command based on-die termination for high-speed NAND interfaceINNOGRIT TECHNOLOGIES CO LTD·Filed 2020·Granted Dec 14, 2021·5 cites·20 claims
- 2996US10262952B2Ring structures in device dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 16, 2019·13 cites·20 claims
- 3096US10181449B1Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 15, 2019·10 cites·20 claims
- 3196US10026704B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 17, 2018·10 cites·20 claims
- 3296US9947626B2Eliminate sawing-induced peeling through forming trenchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 17, 2018·11 cites·20 claims
- 3396US9837379B2Discrete polymer in fan-out packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 5, 2017·11 cites·20 claims
- 3496USD640196SBattery packCHERVON LTD·Filed 2010·Granted Jun 21, 2011·122 cites·1 claims
- 3595US11837579B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 5, 2023·2 cites·20 claims
- 3695US11817363B2Semiconductor die, manufacturing method thereof, and semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 14, 2023·2 cites·20 claims
- 3795US11640958B2Packaged die and RDL with bonding structures therebetweenTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 2, 2023·2 cites·20 claims
- 3895US10269764B2Discrete polymer in fan-out packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·6 cites·20 claims
- 3995US9472522B2Packaging devices and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 18, 2016·14 cites·21 claims
- 4094US11973516B2Soft decoding correctable page assisted LLR estimationINNOGRIT TECHNOLOGIES CO LTD·Filed 2022·Granted Apr 30, 2024·3 cites·23 claims
- 4194US11769704B2Semiconductor structure having an anti-arcing pattern disposed on a passivation layer and a post passivation layer disposed on the anti-arcing patternTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 26, 2023·2 cites·20 claims
- 4294US11605126B1Detecting fraud in credit applicationsWELLS FARGO BANK NA·Filed 2021·Granted Mar 14, 2023·4 cites·20 claims
- 4394US11088041B2Semiconductor packages with shortened talking pathTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·7 cites·20 claims
- 4494US10510668B1Method of fabricating semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·10 cites·20 claims
- 4594US10134685B1Integrated circuit package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 20, 2018·12 cites·20 claims
- 4694USRE46062EFlow guideENDOGUARD LTD·Filed 2015·Granted Jul 12, 2016·61 cites·28 claims
- 4794US8011199B1HVAC control using discrete-speed thermostats and run timesNORDYNE INC·Filed 2010·Granted Sep 6, 2011·65 cites·21 claims
- 4893US11335610B2Semiconductor structure including interconnection to probe pad with probe mark and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·2 cites·20 claims
- 4993US10797001B2Three-dimensional integrated circuit structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 6, 2020·7 cites·19 claims
- 5093US10665572B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 26, 2020·6 cites·20 claims
Showing the top 50 of 517 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →