Inventor · disambiguated record
Jiun-Hua Chiue
Also filed as: CHIUE JIUN-HUA
0 granted patents·7 pending applications·0 citations·filing 2024–2025
Technology areasH10W
Files withAALTOSEMI INC7
Top patents by PatentIndex Score
7 records- 0153US2025014989A1Package substrate and fabricating method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 0252US2025096105A1Package substrate and fabricating method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 0352US2025192014A1Electronic package and manufacturing method thereofAALTOSEMI INC·Filed 2024·Application pending·0 cites
- 0446US2025372400A1Fabricating method of package substrateAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 0544US2025308937A1Manufacturing method of package substrateAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 0643US2025300052A1Semiconductor package and fabricating method thereofAALTOSEMI INC·Filed 2025·Application pending·0 cites
- 0739US2025253261A1Electronic package and manufacturing method thereofAALTOSEMI INC·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →