Inventor · disambiguated record
Jimin Choi
Also filed as: CHOI JIMIN
18 granted patents·15 pending applications·20 citations·filing 2013–2025
89Inventor score
Top patents by PatentIndex Score
33 records- 0188US11476220B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 18, 2022·2 cites·20 claims
- 0288US10211091B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 19, 2019·6 cites·20 claims
- 0387US12183660B2Semiconductor device including through-silicon via and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 31, 2024·1 cites·20 claims
- 0487US11587897B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 21, 2023·2 cites·20 claims
- 0587US9490305B2Organic light emitting display device having dummy sub-pixels with different shapesLG DISPLAY CO LTD·Filed 2013·Granted Nov 8, 2016·5 cites·1 claims
- 0683US10796950B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 6, 2020·3 cites·19 claims
- 0780US2025385127A1Semiconductor device including multi-capping layer and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0874US2025062193A1Semiconductor device including through-silicon via and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0974US2025054916A1Thermal pad, semiconductor chip including the same and method of manufacturing the semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1072US2025300042A1Semiconductor devices including a through-hole electrodeSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1170US9627454B2Organic light emitting display device having dummy sub-pixelsLG DISPLAY CO LTD·Filed 2016·Granted Apr 18, 2017·1 cites·9 claims
- 1269US11948882B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 2, 2024·0 cites·20 claims
- 1368US12424489B2Semiconductor device including multi-capping layer and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 23, 2025·0 cites·20 claims
- 1465US12159859B2Thermal pad, semiconductor chip including the same and method of manufacturing the semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 3, 2024·0 cites·9 claims
- 1565US11646225B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 9, 2023·0 cites·20 claims
- 1664US12347747B2Semiconductor devices including a through-hole electrodeSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 1764US11495533B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 8, 2022·0 cites·20 claims
- 1857US2024194624A1Semiconductor chip and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1956US12288734B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 29, 2025·0 cites·19 claims
- 2056US2024153919A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2156US2024332228A1Semiconductor devices having upper conductive patterns and semiconductor packages having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2255US2024290677A1Semiconductor device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2355US2024113077A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2453US2023076238A1Semiconductor chip with stepped sidewall, semiconductor package including the same, and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2553US2024071923A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2652US2023138616A1Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2751US12072374B2Detection pad structure for analysis in a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 27, 2024·0 cites·20 claims
- 2850US2024038675A1Semiconductor device and semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2949US12006144B2Apparatus for storage of carrying materialSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 11, 2024·0 cites·8 claims
- 3048US2024189991A1Autonomous driving robot and article transport method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3146US12272581B2Steering devices for OHTSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 8, 2025·0 cites·20 claims
- 3244US11881422B2Storage system including shelf moving moduleSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 23, 2024·0 cites·18 claims
- 3339US2021366102A1Inspection apparatus of waferSAMSUNG ELECTRONICS CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →