Inventor · disambiguated record
Jin-Ho Chun
Also filed as: CHUN JIN-HO
13 granted patents·5 pending applications·304 citations·filing 2009–2021
91Inventor score
Top patents by PatentIndex Score
18 records- 0198US9461007B2Wafer-to-wafer bonding structureSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 4, 2016·239 cites·20 claims
- 0296US9520361B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 13, 2016·28 cites·20 claims
- 0395US8957526B2Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 17, 2015·19 cites·8 claims
- 0486US9691685B2Semiconductor devices and methods of manufacturing the same, and semiconductor packages including the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jun 27, 2017·4 cites·20 claims
- 0583US10833032B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 10, 2020·3 cites·20 claims
- 0682US11469202B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 11, 2022·1 cites·20 claims
- 0782US10580726B2Semiconductor devices and semiconductor packages including the same, and methods of manufacturing the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 3, 2020·3 cites·20 claims
- 0880US9698051B2Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jul 4, 2017·3 cites·19 claims
- 0971US11798906B2Semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 24, 2023·0 cites·19 claims
- 1071US10483224B2Semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 19, 2019·1 cites·20 claims
- 1162US8735281B2Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 27, 2014·1 cites·20 claims
- 1261US11251144B2Semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 15, 2022·0 cites·23 claims
- 1357US8456012B2Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the sameSHIN CHANG-WOO·Filed 2009·Granted Jun 4, 2013·2 cites·19 claims
- 1452US2017345713A1Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2017·Application pending·0 cites
- 1543US2014329382A1Method of fabricating semiconductor device having bumpSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 1642US2013313722A1Through-silicon via (tsv) semiconductor devices having via pad inlaysSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 1741US2013221519A1Semiconductor devices including dummy solder bumpsSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 1832US2017125364A1Integrated circuit device having through via based alignment keys and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →