Inventor · disambiguated record
Jinsuk Chung
Also filed as: CHUNG JINSUK
0 granted patents·2 pending applications·0 citations·filing 2023–2024
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD2
Top patents by PatentIndex Score
2 records- 0152US2025167174A1Semiconductor package and method of implementing redistribution layer in ball grid arraySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0246US2024196633A1Memory device and system having multiple physical interfacesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →