Inventor · disambiguated record
Jingna Cui
Also filed as: CUI JINGNA
1 granted patent·2 pending applications·0 citations·filing 2018–2024
11Inventor score
Files withBYD CO LTD3
Top patents by PatentIndex Score
3 records- 0160US2024254038A1Glass substrate, manufacturing method therefor, and electronic deviceBYD CO LTD·Filed 2024·Application pending·0 cites
- 0259US2024140861A1Strengthened glass and glass strengthening method, and electronic device housingBYD CO LTD·Filed 2023·Application pending·0 cites
- 0347US10751922B2Metal-resin composite and preparation methodBYD CO LTD·Filed 2018·Granted Aug 25, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →