Inventor · disambiguated record
Jinpeng Dai
Also filed as: DAI JINPENG
1 granted patent·1 pending application·0 citations·filing 2023–2024
9Inventor score
Top patents by PatentIndex Score
2 records- 0171US12071375B1Cemented filling material with bionic structure and preparation method and application thereofUNIV CHINA MINING·Filed 2024·Granted Aug 27, 2024·0 cites·6 claims
- 0245US2024353458A1Method for processing anisotropic magnetized plasma medium and system thereofUNIV ANHUI·Filed 2023·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Jinpeng Dai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →