Inventor · disambiguated record
Jian Dai
Also filed as: DAI JIAN · DAI JIAN HONG
2 granted patents·1 pending application·0 citations·filing 2006–2020
26Inventor score
Top patents by PatentIndex Score
3 records- 0157US11876016B2Methods for forming hole structure in semiconductor deviceYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 16, 2024·0 cites·20 claims
- 0251US11817348B2Methods for forming hole structure in semiconductor deviceYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Nov 14, 2023·0 cites·20 claims
- 0336US2010307800A1Anodised Aluminum, Dielectric, and MethodOPULENT ELECTRONICS INTERNAT PTE LTD·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →