Inventor · disambiguated record

Jiandi Du

Also filed as: DU JIANDI

7 granted patents·11 citations·filing 2020–2022

74Inventor score

Technology areasH10W

Files withWESTERN DIGITAL TECH INC7

Top patents by PatentIndex Score

7 records

0194US11444001B1Thermoelectric semiconductor device and method of making sameWESTERN DIGITAL TECH INC·Filed 2021·Granted Sep 13, 2022·8 cites·20 claims
0289US11837476B2Flip-chip package with reduced underfill areaWESTERN DIGITAL TECH INC·Filed 2020·Granted Dec 5, 2023·3 cites·9 claims
0366US11901260B2Thermoelectric semiconductor device and method of making sameWESTERN DIGITAL TECH INC·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
0453US11784135B2Semiconductor device including conductive bumps to improve EMI/RFI shieldingWESTERN DIGITAL TECH INC·Filed 2021·Granted Oct 10, 2023·0 cites·18 claims
0552US11810896B2Substrate component layout and bonding method for increased package capacityWESTERN DIGITAL TECH INC·Filed 2021·Granted Nov 7, 2023·0 cites·20 claims
0650US11488883B1Semiconductor device package having thermally conductive layers for heat dissipationWESTERN DIGITAL TECH INC·Filed 2021·Granted Nov 1, 2022·0 cites·20 claims
0747US12347810B2Semiconductor device package die stacking system and methodWESTERN DIGITAL TECH INC·Filed 2021·Granted Jul 1, 2025·0 cites·13 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →