Inventor · disambiguated record
Ji Hyun Eom
Also filed as: EOM JI · EOM JI HYUN
7 granted patents·2 pending applications·11 citations·filing 2012–2020
77Inventor score
Top patents by PatentIndex Score
9 records- 0193US10546680B2Coil electronic component with anisotropic parts and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jan 28, 2020·6 cites·22 claims
- 0284US10504644B2Coil componentSAMSUNG ELECTRO MECH·Filed 2017·Granted Dec 10, 2019·2 cites·19 claims
- 0384US10340073B2Coil component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jul 2, 2019·2 cites·20 claims
- 0477US11284538B2Electronic device including composite heat dissipation member and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 22, 2022·1 cites·18 claims
- 0571US11270829B2Coil componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Mar 8, 2022·0 cites·20 claims
- 0669US10490337B2Coil component and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Nov 26, 2019·0 cites·13 claims
- 0756US11721468B2Coil componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Aug 8, 2023·0 cites·15 claims
- 0843US2014331493A1Method of fabricating a package substrateSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 0941US2013168853A1Package substrate and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →