Inventor · disambiguated record

Jiagui Feng

Also filed as: FENG JIAGUI

1 granted patent·3 pending applications·0 citations·filing 2022–2025

13Inventor score

Technology areasH10W

Files withTENCENT TECH SHENZHEN CO LTD4

Top patents by PatentIndex Score

4 records

0160US12225832B2Method for fabricating air bridge, air bridge structure, and superconducting quantum chipTENCENT TECH SHENZHEN CO LTD·Filed 2022·Granted Feb 11, 2025·0 cites·13 claims
0255US2025151632A1Air bridge structure and fabrication methodTENCENT TECH SHENZHEN CO LTD·Filed 2025·Application pending·0 cites
0349US2023197572A1Through-silicon-via structure and method for preparing same, through-silicon-via interconnection structure and method for preparing same, and electronic deviceTENCENT TECH SHENZHEN CO LTD·Filed 2023·Application pending·0 cites
0444US2022216134A1Air bridge structure and manufacturing method thereof, and superconducting quantum chip and manufacturing method thereofTENCENT TECH SHENZHEN CO LTD·Filed 2022·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →