Inventor · disambiguated record
Jindong Feng
Also filed as: FENG JINDONG
8 granted patents·6 pending applications·0 citations·filing 2020–2024
72Inventor score
Top patents by PatentIndex Score
14 records- 0170US12148676B2Embedded chip package and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Granted Nov 19, 2024·0 cites·9 claims
- 0264US12412843B2Support frame structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Granted Sep 9, 2025·0 cites·5 claims
- 0362US11854920B2Embedded chip package and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2020·Granted Dec 26, 2023·0 cites·9 claims
- 0461US12040526B2Method for manufacturing embedded package structure having air resonant cavityZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Jul 16, 2024·0 cites·14 claims
- 0559US12476230B2Embedded packaging structure and method for manufacturing the sameZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Nov 18, 2025·0 cites·7 claims
- 0658US11569177B2Support frame structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2020·Granted Jan 31, 2023·0 cites·7 claims
- 0758US2024321594A1Embedded magnet frame, integrated structure and manufacturing methodZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 0857US2024312879A1Metal frame chip embedded packaging substrate and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 0956US2024063055A1Manufacturing method for device embedded packaging structureZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 1052US12002734B2Circuit prearranged heat dissipation embedded packaging structure and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Jun 4, 2024·0 cites·20 claims
- 1151US2023154857A1Two-sided interconnected embedded chip packaging structure and manufacturing method thereforZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 1251US2023276576A1Package substrate and manufacturing method thereofZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 1350US12463055B2Package substrate manufacturing methodZHUHAI ACCESS SEMICONDUCTOR CO LTD·Filed 2021·Granted Nov 4, 2025·0 cites·10 claims
- 1444US2024030146A1Multichip interconnecting packaging structure and manufacturing method thereofNANTONG ACCESS SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →