Inventor · disambiguated record
Jia Yan Go
Also filed as: GO JIA YAN
6 granted patents·3 pending applications·12 citations·filing 2015–2025
74Inventor score
Files withINTEL CORP9
Top patents by PatentIndex Score
9 records- 0193US12284793B2Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling systems, cooling structures and electronic devicesINTEL CORP·Filed 2020·Granted Apr 22, 2025·6 cites·21 claims
- 0281US10856454B2Electromagnetic interference (EMI) shield for circuit card assembly (CCA)INTEL CORP·Filed 2019·Granted Dec 1, 2020·3 cites·20 claims
- 0379US11006514B2Three-dimensional decoupling integration within hole in motherboardINTEL CORP·Filed 2017·Granted May 11, 2021·3 cites·25 claims
- 0467US2025254848A1Cooling systems, cooling structures and electronic devices and methods for manufacturing or operating cooling sys-tems, cooling structures and electronic devicesINTEL CORP·Filed 2025·Application pending·0 cites
- 0564US2025016930A1Printed circuit boards with inductors in the mounting holesINTEL CORP·Filed 2024·Application pending·0 cites
- 0648US2023108868A1Methods and apparatus to increase rigidity of printed circuit boardsINTEL CORP·Filed 2022·Application pending·0 cites
- 0746US10163777B2Interconnects for semiconductor packagesINTEL CORP·Filed 2017·Granted Dec 25, 2018·0 cites·14 claims
- 0839US10492299B2Electronic assembly that includes a substrate bridgeINTEL CORP·Filed 2015·Granted Nov 26, 2019·0 cites·8 claims
- 0933US11133261B2Electronic device packagingINTEL CORP·Filed 2017·Granted Sep 28, 2021·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →