Inventor · disambiguated record
Jianwen Han
Also filed as: HAN JIANWEN
11 granted patents·8 pending applications·44 citations·filing 2002–2023
87Inventor score
Top patents by PatentIndex Score
19 records- 0186US7427344B2Methods for determining organic component concentrations in an electrolytic solutionADVANCED TECH MATERIALS·Filed 2005·Granted Sep 23, 2008·4 cites·20 claims
- 0284US11384446B2Compositions and methods for the electrodeposition of nanotwinned copperMACDERMID ENTHONE INC·Filed 2020·Granted Jul 12, 2022·1 cites·12 claims
- 0382US2024110306A1Compositions and Methods for the Electrodeposition of Nanotwinned CopperMACDERMID ENTHONE INC·Filed 2023·Application pending·0 cites
- 0480US11873568B2Compositions and methods for the electrodeposition of nanotwinned copperMACDERMID ENTHONE INC·Filed 2022·Granted Jan 16, 2024·0 cites·15 claims
- 0580US11035048B2Cobalt filling of interconnectsMACDERMID ENTHONE INC·Filed 2017·Granted Jun 15, 2021·3 cites·30 claims
- 0678US6984299B2Methods for determining organic component concentrations in an electrolytic solutionADVANCED TECHNOLOGY MATERIAL I·Filed 2004·Granted Jan 10, 2006·10 cites·7 claims
- 0776US6709568B2Method for determining concentrations of additives in acid copper electrochemical deposition bathsADVANCED TECH MATERIALS·Filed 2002·Granted Mar 23, 2004·20 cites·20 claims
- 0870US11434578B2Cobalt filling of interconnects in microelectronicsMACDERMID ENTHONE INC·Filed 2021·Granted Sep 6, 2022·0 cites·28 claims
- 0966US11401618B2Cobalt filling of interconnectsMACDERMID ENTHONE INC·Filed 2021·Granted Aug 2, 2022·0 cites·31 claims
- 1064US7435320B2Methods and apparatuses for monitoring organic additives in electrochemical deposition solutionsADVANCED TECH MATERIALS·Filed 2004·Granted Oct 14, 2008·5 cites·13 claims
- 1163US10995417B2Cobalt filling of interconnects in microelectronicsMACDERMID ENTHONE INC·Filed 2016·Granted May 4, 2021·0 cites·20 claims
- 1262US2007102301A1One-point recalibration method for reducing error in concentration measurements for an electrolytic solutionHAN JIANWEN·Filed 2006·Application pending·0 cites
- 1357US7141156B2One-point recalibration method for reducing error in concentration measurements for an electrolytic solutionADVANCED TECH MATERIALS·Filed 2004·Granted Nov 28, 2006·1 cites·23 claims
- 1449US2024318342A1Compositions and methods for the eletrodeposition of nanotwinned copperMACDERMID ENTHONE INC·Filed 2022·Application pending·0 cites
- 1547US2007261963A1Simultaneous inorganic, organic and byproduct analysis in electrochemical deposition solutionsADVANCED TECH MATERIALS·Filed 2007·Application pending·0 cites
- 1646US2005236280A1Methods for analyzing inorganic components of an electrolytic solution, and /or cleaning an electrochemical analytical cellHAN JIANWEN·Filed 2004·Application pending·0 cites
- 1745US2005109624A1On-wafer electrochemical deposition plating metrology process and apparatusFiled 2003·Application pending·0 cites
- 1845US2005067304A1Electrode assembly for analysis of metal electroplating solution, comprising self-cleaning mechanism, plating optimization mechanism, and/or voltage limiting mechanismFiled 2003·Application pending·0 cites
- 1942US2009200171A1Electrochemical sensing and data analysis system, apparatus and method for metal platingADVANCED TECH MATERIALS·Filed 2007·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Jianwen Han files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →