Inventor · disambiguated record
Jian-Yang He
Also filed as: He jian-yang
4 granted patents·1 pending application·0 citations·filing 2018–2024
57Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD5
Top patents by PatentIndex Score
5 records- 0174US12272663B2Metal-bump sidewall protectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 8, 2025·0 cites·20 claims
- 0266US11476219B2Metal-bump sidewall protectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 18, 2022·0 cites·20 claims
- 0361US12500195B2Connecting structure, package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 16, 2025·0 cites·20 claims
- 0459US2025343121A1Interposer module including interconnects with alloy barrier, package structure including the interposer module and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0557US10784222B2Metal-bump sidewall protectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 22, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →