Inventor · disambiguated record
Jitsuho Hirota
Also filed as: HIROTA JITSUHO
6 granted patents·164 citations·filing 1986–2001
84Inventor score
Top patents by PatentIndex Score
6 records- 0178US5950908ASolder supplying method, solder supplying apparatus and soldering methodMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Sep 14, 1999·58 cites·15 claims
- 0274US5302550AMethod of bonding a microelectronic deviceMITSUBISHI ELECTRIC CORP·Filed 1988·Granted Apr 12, 1994·52 cites·15 claims
- 0370US4705204AMethod of ball forming for wire bondingMITSUBISHI ELECTRIC CORP·Filed 1986·Granted Nov 10, 1987·39 cites·8 claims
- 0462US6768062B2Connection method and connection structure of pad electrodes, and inspecting methods for connection state thereofMURATA MANUFACTURING CO·Filed 2001·Granted Jul 27, 2004·10 cites·1 claims
- 0550US6598779B2Electronic component mounting methodMURATA MANUFACTURING CO·Filed 2001·Granted Jul 29, 2003·4 cites·7 claims
- 0626US4739142AMethod of producing a wire bonding ballMITSUBISHI ELECTRIC CORP·Filed 1986·Granted Apr 19, 1988·1 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →