Inventor · disambiguated record
Ji-Sun Hong
Also filed as: HONG JI-SUN
5 granted patents·2 pending applications·60 citations·filing 2005–2016
77Inventor score
Top patents by PatentIndex Score
7 records- 0194US8829686B2Package-on-package assembly including adhesive containment elementSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Sep 9, 2014·24 cites·19 claims
- 0290US7379113B2Image sensor module having auto-aligned lens, and method of fabricating the same, and method of automatically controlling focus of lensSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 27, 2008·32 cites·22 claims
- 0372US10068878B2Printed circuit board (PCB), method of manufacturing the PCB, and method of manufacturing semiconductor package using the PCBSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 4, 2018·2 cites·19 claims
- 0458US8563349B2Method of forming semiconductor deviceMYUNG JONG-YUN·Filed 2011·Granted Oct 22, 2013·2 cites·5 claims
- 0542US2009057845A1Apparatus to saw wafer and having nozzle to remove burrs in scribe lanes, method of sawing wafer, and semiconductor package fabricated by the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 0638US2012193783A1Package on packageHONG JI-SUN·Filed 2011·Application pending·0 cites
- 0737US8304288B2Methods of packaging semiconductor devices including bridge patternsLEE HYUEK-JAE·Filed 2011·Granted Nov 6, 2012·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →