Inventor · disambiguated record
Jiseok Hong
Also filed as: HONG JISEOK
16 granted patents·1 pending application·34 citations·filing 2018–2025
90Inventor score
Files withSAMSUNG ELECTRONICS CO LTD17
Top patents by PatentIndex Score
17 records- 0196US11404395B2Semiconductor package including underfill material layer and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 2, 2022·8 cites·18 claims
- 0295US11289438B2Die-to-wafer bonding structure and semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 29, 2022·5 cites·20 claims
- 0395US11244927B2Semiconductor package having stacked semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 8, 2022·4 cites·20 claims
- 0494US11721673B2Semiconductor package having stacked semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 8, 2023·3 cites·20 claims
- 0594US11658141B2Die-to-wafer bonding structure and semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 23, 2023·3 cites·20 claims
- 0690US10410916B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 10, 2019·7 cites·20 claims
- 0788US11158594B2Semiconductor packages having improved reliability in bonds between connection conductors and padsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 26, 2021·2 cites·20 claims
- 0881US11908797B2Integrated circuit device having a bit line and a main insulating spacer with an extended portionSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 20, 2024·1 cites·17 claims
- 0976US11557596B2Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 17, 2023·1 cites·20 claims
- 1071US12419042B2Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 16, 2025·0 cites·20 claims
- 1169US11764192B2Semiconductor package including underfill material layer and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 19, 2023·0 cites·20 claims
- 1269US2025324580A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1365US11647627B2Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 9, 2023·0 cites·20 claims
- 1464US11251070B2Semiconductor device including a passivation spacer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 15, 2022·0 cites·10 claims
- 1563US11676925B2Semiconductor packages having improved reliability in bonds between connection conductors and pads and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·0 cites·20 claims
- 1660US12363891B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 1753US10790186B2Semiconductor device including a passivation spacer and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 29, 2020·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →