Inventor · disambiguated record
Ji-Ho Hong
Also filed as: HONG JI H · HONG JI HO
20 granted patents·35 pending applications·65 citations·filing 2004–2021
93Inventor score
Files withHONG JI-HO23DONGBU HITEK CO LTD17DONGBU ELECTRONICS CO LTD5HONG JI H3DONGBUANAM SEMICONDUCTOR INC2
Top patents by PatentIndex Score
55 records- 0187US11655951B2Lamp for vehicleSL CORP·Filed 2021·Granted May 23, 2023·2 cites·16 claims
- 0282US7683408B2Image sensorDONGBU HITEK CO LTD·Filed 2007·Granted Mar 23, 2010·7 cites·11 claims
- 0381US7851235B2Test element group for monitoring leakage current in semiconductor device and method of manufacturing the sameDONGBU HITEK CO LTD·Filed 2008·Granted Dec 14, 2010·8 cites·6 claims
- 0480US7589021B2Copper metal interconnection with a local barrier metal layerDONGBU HITEK CO LTD·Filed 2006·Granted Sep 15, 2009·7 cites·5 claims
- 0578US7368397B2Method for monitoring edge bead removal process of copper metal interconnectionDONGBU ELECTRONICS CO LTD·Filed 2006·Granted May 6, 2008·6 cites·19 claims
- 0677US7300866B2Method for fabricating metal line in a semiconductorDONGBU ELECTRONICS CO LTD·Filed 2005·Granted Nov 27, 2007·8 cites·20 claims
- 0774US7544601B2Semiconductor device and a method for manufacturing the sameDONGBU HITEK CO LTD·Filed 2006·Granted Jun 9, 2009·5 cites·7 claims
- 0872US7883950B2Semiconductor device having reduced polysilicon pattern width and method of manufacturing the sameDONGBU HITEK CO LTD·Filed 2007·Granted Feb 8, 2011·5 cites·12 claims
- 0968US7790609B2Method of forming metal line in semiconductor deviceDONGBU HITEK CO LTD·Filed 2007·Granted Sep 7, 2010·4 cites·12 claims
- 1068US7439182B2Semiconductor device and method of fabricating the sameDONGBU ELECTRONICS CO LTD·Filed 2006·Granted Oct 21, 2008·4 cites·16 claims
- 1167US7968366B2Image sensor and method for manufacturing the sameDONGBU HITEK CO LTD·Filed 2008·Granted Jun 28, 2011·1 cites·11 claims
- 1267US7683409B2Image sensorDONGBU HITEK CO LTD·Filed 2008·Granted Mar 23, 2010·1 cites·9 claims
- 1365US7800107B2Test module for semiconductor deviceDONGBU HITEK CO LTD·Filed 2007·Granted Sep 21, 2010·2 cites·8 claims
- 1462US7482262B2Method of manufacturing semiconductor deviceDONGBU HITEK CO LTD·Filed 2006·Granted Jan 27, 2009·2 cites·20 claims
- 1556US7888673B2Monitoring semiconductor device and method of manufacturing the sameDONGBU HITEK CO LTD·Filed 2008·Granted Feb 15, 2011·1 cites·13 claims
- 1653US2024026511A1High-strength galvannealed steel sheet having excellent powdering resistance and manufacturing method thereforPOSCO CO LTD·Filed 2021·Application pending·0 cites
- 1749US7238617B2Method for fabricating semiconductor device to minimize terminal effect in ECP processDONGBU ELECTRONICS CO LTD·Filed 2004·Granted Jul 3, 2007·2 cites·10 claims
- 1847US8049265B2Semiconductor device and method of fabricating the sameDONGBU HITEK CO LTD·Filed 2008·Granted Nov 1, 2011·0 cites·20 claims
- 1945US7642186B2Metal line of semiconductor device and method of forming the sameDONGBU HITEK CO LTD·Filed 2007·Granted Jan 5, 2010·0 cites·13 claims
- 2045US2009212334A1Semiconductor device and a method for manufacturing the sameHONG JI HO·Filed 2009·Application pending·0 cites
- 2144US2008157800A1TEG pattern and method for testing semiconductor device using the sameDONGBU HITEK CO LTD·Filed 2007·Application pending·0 cites
- 2243US7723795B2Semiconductor memory deviceDONGBU HITEK CO LTD·Filed 2008·Granted May 25, 2010·0 cites·20 claims
- 2343US2008157380A1Method for forming metal interconnection of semiconductor deviceDONGBU HITEK CO LTD·Filed 2007·Application pending·0 cites
- 2442US2007155145A1Method for forming a copper metal interconnection of a semiconductor device using two seed layersDONGBU ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2542US2008160714A1Method of forming semiconductor deviceDONGBU HITEK CO LTD·Filed 2007·Application pending·0 cites
- 2642US2007056856A1Apparatus and method for electrically contacting wafer in electronic chemical plating cellDONGBUANAM SEMICONDUCTOR INC·Filed 2005·Application pending·0 cites
- 2742US2006137714A1Apparatus for removing edge bead in plating process for fabricating semiconductor deviceDONGBUANAM SEMICONDUCTOR INC·Filed 2005·Application pending·0 cites
- 2841US2006137989A1Electrochemical plating apparatus and methodHONG JI H·Filed 2005·Application pending·0 cites
- 2941US2007060474A1Cleansing method of electrochemical plating cellHONG JI H·Filed 2005·Application pending·0 cites
- 3040US8097505B2Method of forming isolation layer in semiconductor deviceHONG JI-HO·Filed 2008·Granted Jan 17, 2012·0 cites·10 claims
- 3140US2009160060A1Method of manufacturing semiconductor deviceHONG JI-HO·Filed 2008·Application pending·0 cites
- 3240US2007077755A1Method of forming metal wiring in a semiconductor deviceHONG JI H·Filed 2005·Application pending·0 cites
- 3339US2009098670A1Semiconductor device for monitoring current characteristic and monitoring method for current characteristic of semiconductor deviceHONG JI-HO·Filed 2008·Application pending·0 cites
- 3439US2009305481A1Method for manufacturing semiconductor memory deviceHONG JI HO·Filed 2009·Application pending·0 cites
- 3538US2023053119A1FUSION POLYPEPTIDE COMPRISING Fc REGION OF IMMUNOGLOBULIN AND GDF15LG CHEMICAL LTD·Filed 2020·Application pending·0 cites
- 3638US2023133672A1Fusion polypeptide comprising gdf15 and polypeptide region capable of o-glycosylationLG CHEMICAL LTD·Filed 2020·Application pending·0 cites
- 3738US2008160655A1Method of verifying line reliability and method of manufacturing semiconductor deviceHONG JI HO·Filed 2007·Application pending·0 cites
- 3838US2008157164A1Flash Memory and Method for Fabricating ThereofHONG JI HO·Filed 2007·Application pending·0 cites
- 3938US2005153545A1Methods of forming copper interconnections using electrochemical plating processesFiled 2004·Application pending·0 cites
- 4037US2008054315A1Method for manufacturing semiconductor device by using two step pocket implant processHONG JI-HO·Filed 2007·Application pending·0 cites
- 4137US2008048272A1Silicidation monitoring pattern for use in semiconductor manufacturing processHONG JI-HO·Filed 2007·Application pending·0 cites
- 4237US2008050917A1Method of manufacturing semiconductor deviceHONG JI-HO·Filed 2007·Application pending·0 cites
- 4337US2008160672A1Method for manufacturing semiconductor deviceHONG JI-HO·Filed 2007·Application pending·0 cites
- 4437US2009261477A1Semiconductor device and method of manufacturing the sameHONG JI-HO·Filed 2007·Application pending·0 cites
- 4536US2007134509A1Copper interconnection structure and method for forming sameHONG JI HO·Filed 2006·Application pending·0 cites
- 4636US2008079098A1Semiconductor Device and Fabricating Method ThereofHONG JI HO·Filed 2007·Application pending·0 cites
- 4736US2008048324A1Fabricating Semiconductor DeviceHONG JI HO·Filed 2007·Application pending·0 cites
- 4836US2008124554A1Semiconductor device and method for manufacturing the sameHONG JI-HO·Filed 2007·Application pending·0 cites
- 4936US2008124916A1Method of Manufacturing Semiconductor DeviceHONG JI HO·Filed 2007·Application pending·0 cites
- 5036US2008122092A1Semiconductor Device and Method of Manufacturing the SameHONG JI HO·Filed 2007·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →