Inventor · disambiguated record
Jiun-Jie Huang
Also filed as: HUANG JIUN-JIE
10 granted patents·7 pending applications·14 citations·filing 2010–2024
82Inventor score
Files withHUANG JIUN-JIE6TAIWAN SEMICONDUCTOR MFG CO LTD4DELTA ELECTRONICS INC2CHEN HSIEN TE1HSU HSUAN HAO1
Top patents by PatentIndex Score
17 records- 0178US10608094B2Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Mar 31, 2020·2 cites·20 claims
- 0277US8558350B2Metal-oxide-metal capacitor structureHUANG JIUN-JIE·Filed 2011·Granted Oct 15, 2013·5 cites·20 claims
- 0373US9064841B2Metal-oxide-metal capacitor apparatus with a via-hole regionHUANG JIUN-JIE·Filed 2011·Granted Jun 23, 2015·4 cites·22 claims
- 0471US2023166141A1Flameproof electronic deviceDELTA ELECTRONICS INC·Filed 2022·Application pending·0 cites
- 0565US2025205525A1Fire extinguishing structure of battery moduleDELTA ELECTRONICS INC·Filed 2024·Application pending·0 cites
- 0664US9105634B2Voids in interconnect structures and methods for forming the sameHUANG JIUN-JIE·Filed 2012·Granted Aug 11, 2015·1 cites·20 claims
- 0763US8648341B2Methods and apparatus for testing pads on wafersYANG CHUNG-YUAN·Filed 2012·Granted Feb 11, 2014·2 cites·20 claims
- 0857US12237282B2Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 25, 2025·0 cites·20 claims
- 0955US2013306357A1Epoxy resin composition, and prepreg and printed circuit board usng the sameTAIWAN UNION TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 1053US2024371917A1Resistor structure having cavities for increased resistor performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1150US9837348B2Voids in interconnect structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 5, 2017·0 cites·20 claims
- 1250US8468474B2Reducing metal pits through optical proximity correctionHUANG JIUN-JIE·Filed 2012·Granted Jun 18, 2013·0 cites·10 claims
- 1346US8341562B1Reducing metal pits through optical proximity correctionHUANG JIUN-JIE·Filed 2011·Granted Dec 25, 2012·0 cites·10 claims
- 1443US2012024580A1Epoxy resin composition, and prepreg and printed circuit board using the sameHSU HSUAN HAO·Filed 2010·Application pending·0 cites
- 1541US8476629B2Enhanced wafer test line structureHUANG JIUN-JIE·Filed 2011·Granted Jul 2, 2013·0 cites·20 claims
- 1641US2013143046A1Epoxy resin composition, and prepreg and metal-clad laminate using the sameCHEN HSIEN TE·Filed 2012·Application pending·0 cites
- 1734US2012329912A1Fused filler and its manufacturing method and useLiu cheng-ping·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →