Inventor · disambiguated record
Jihwan Hwang
Also filed as: HWANG JIHWAN
18 granted patents·9 pending applications·28 citations·filing 2012–2024
90Inventor score
Top patents by PatentIndex Score
27 records- 0196US11404395B2Semiconductor package including underfill material layer and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 2, 2022·8 cites·18 claims
- 0295US11289438B2Die-to-wafer bonding structure and semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 29, 2022·5 cites·20 claims
- 0395US11244927B2Semiconductor package having stacked semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 8, 2022·4 cites·20 claims
- 0494US11721673B2Semiconductor package having stacked semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 8, 2023·3 cites·20 claims
- 0594US11658141B2Die-to-wafer bonding structure and semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 23, 2023·3 cites·20 claims
- 0688US11158594B2Semiconductor packages having improved reliability in bonds between connection conductors and padsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 26, 2021·2 cites·20 claims
- 0782US2023357495A1Monomer composition for synthesizing recycled plastic, preparation method thereof, and recycled plastic, molded product, plasticizer composition using the sameLG CHEMICAL LTD·Filed 2022·Application pending·0 cites
- 0882US2023383052A1Monomer composition for synthesizing recycled plastic, preparation method thereof, and recycled plastic, molded product, plasticizer composition using the sameLG CHEMICAL LTD·Filed 2022·Application pending·0 cites
- 0980US2023374247A1Monomer composition for synthesizing recycled plastic, preparation method thereof, and recycled plastic, molded product, plasticizer composition using the sameLG CHEMICAL LTD·Filed 2022·Application pending·0 cites
- 1080US2023374250A1Monomer composition for synthesizing recycled plastic, preparation method thereof, and recycled plastic, molded product, plasticizer composition using the sameLG CHEMICAL LTD·Filed 2022·Application pending·0 cites
- 1179US11658148B2Semiconductor package and a method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 23, 2023·1 cites·20 claims
- 1277US2024332255A1Semiconductor package and a method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1376US12040313B2Semiconductor package and a method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 1471US10651154B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 12, 2020·1 cites·20 claims
- 1569US11955449B2Stacked semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 9, 2024·0 cites·20 claims
- 1669US11791308B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 17, 2023·0 cites·20 claims
- 1769US11764192B2Semiconductor package including underfill material layer and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 19, 2023·0 cites·20 claims
- 1867US9589947B2Semiconductor packages and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 7, 2017·1 cites·16 claims
- 1967US2025333574A1Preparation method of monomer composition for synthesising recycled plastic, and monomer composition for synthesising recycled plastic, recycled plastic using the same, molded product using the sameLG CHEMICAL LTD·Filed 2023·Application pending·0 cites
- 2064US2025129003A1Monomer composition for synthesizing recycled plastic, preparation method thereof, recycled plastic, and molded product using the sameLG CHEMICAL LTD·Filed 2023·Application pending·0 cites
- 2163US11676925B2Semiconductor packages having improved reliability in bonds between connection conductors and pads and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·0 cites·20 claims
- 2263US11508685B2Stacked semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 22, 2022·0 cites·20 claims
- 2362US11362062B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 14, 2022·0 cites·20 claims
- 2461US2025340711A1Monomer composition for synthesizing recycled plastic, preparation method thereof, and recycled plastic, molded product using the sameLG CHEMICAL LTD·Filed 2023·Application pending·0 cites
- 2550US12057425B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 6, 2024·0 cites·20 claims
- 2647US2012280405A1Semiconductor packages and methods of manufacuring the sameHWANG JIHWAN·Filed 2012·Application pending·0 cites
- 2742US10090278B2Semiconductor packagesPARK SANG SICK·Filed 2016·Granted Oct 2, 2018·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →