Inventor · disambiguated record
Jinhee Jung
Also filed as: JUNG JINHEE
36 granted patents·19 pending applications·74 citations·filing 2013–2025
96Inventor score
Top patents by PatentIndex Score
55 records- 0198US11610847B2Laser-based redistribution and multi-stacked packagesSTATS CHIPPAC PTE LTD·Filed 2021·Granted Mar 21, 2023·7 cites·22 claims
- 0297US11862572B2Laser-based redistribution and multi-stacked packagesSTATS CHIPPAC PTE LTD·Filed 2023·Granted Jan 2, 2024·4 cites·25 claims
- 0397US11640944B2Semiconductor device and method of forming a slot in EMI shielding layer using a plurality of slot lines to guide a laserSTATS CHIPPAC PTE LTD·Filed 2021·Granted May 2, 2023·4 cites·31 claims
- 0497US9837484B2Semiconductor device and method of forming substrate including embedded component with symmetrical structureSTATS CHIPPAC LTD·Filed 2015·Granted Dec 5, 2017·31 cites·24 claims
- 0596US11393698B2Mask design for improved attach positionSTATS CHIPPAC PTE LTD·Filed 2020·Granted Jul 19, 2022·4 cites·22 claims
- 0695US12362287B2Semiconductor device and method of making double shielding layers over the semiconductor deviceSTATS CHIPPAC PTE LTD·Filed 2022·Granted Jul 15, 2025·2 cites·17 claims
- 0794US11990424B2Selective EMI shielding using preformed maskSTATS CHIPPAC PTE LTD·Filed 2023·Granted May 21, 2024·2 cites·22 claims
- 0894US11862478B2Mask design for improved attach positionSTATS CHIPPAC PTE LTD·Filed 2022·Granted Jan 2, 2024·2 cites·25 claims
- 0991US11616025B2Selective EMI shielding using preformed mask with fang designSTATS CHIPPAC PTE LTD·Filed 2020·Granted Mar 28, 2023·2 cites·23 claims
- 1091US11594186B2Display device and driving circuit having improved stabilityLG DISPLAY CO LTD·Filed 2021·Granted Feb 28, 2023·2 cites·15 claims
- 1190US11664327B2Selective EMI shielding using preformed maskSTATS CHIPPAC PTE LTD·Filed 2020·Granted May 30, 2023·2 cites·22 claims
- 1286US10418341B2Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulantSTATS CHIPPAC PTE LTD·Filed 2017·Granted Sep 17, 2019·4 cites·25 claims
- 1384US11756897B2Semiconductor device and method of forming a slot in EMI shielding with improved removal depthSTATS CHIPPAC PTE LTD·Filed 2021·Granted Sep 12, 2023·1 cites·25 claims
- 1483US12374593B2Semiconductor device and method of forming electrical circuit pattern within encapsulant of sip moduleSTATS CHIPPAC PTE LTD·Filed 2024·Granted Jul 29, 2025·0 cites·18 claims
- 1582US12394727B2Semiconductor device and method for forming electromagnetic interference (EMI) shielded packages with laser-based redistribution and multi-stacked packagesSTATS CHIPPAC PTE LTD·Filed 2023·Granted Aug 19, 2025·0 cites·24 claims
- 1681US10236337B2Semiconductor device and method of forming substrate including embedded component with symmetrical structureSTATS CHIPPAC PTE LTD·Filed 2017·Granted Mar 19, 2019·2 cites·25 claims
- 1779US12266615B2Selective EMI shielding using preformed mask with fang designSTATS CHIPPAC PTE LTD·Filed 2023·Granted Apr 1, 2025·0 cites·23 claims
- 1879US11923260B2Semiconductor device and method of forming electrical circuit pattern within encapsulant of SIP moduleSTATS CHIPPAC PTE LTD·Filed 2023·Granted Mar 5, 2024·0 cites·20 claims
- 1977US12288781B2PSPI-based patterning method for RDLSTATS CHIPPAC PTE LTD·Filed 2023·Granted Apr 29, 2025·0 cites·21 claims
- 2076US2025309137A1Semiconductor Device and Method of Double ShieldingSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 2175US12255152B2Semiconductor device and method of forming a slot in EMI shielding with improved removal depthSTATS CHIPPAC PTE LTD·Filed 2023·Granted Mar 18, 2025·0 cites·23 claims
- 2275US2025201729A1Selective EMI Shielding Using Preformed Mask with Fang DesignSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 2373US12469796B2Method of forming an embedded magnetic shielding deviceSTATS CHIPPAC PTE LTD·Filed 2022·Granted Nov 11, 2025·0 cites·23 claims
- 2473US12431438B2Semiconductor device and method for partial EMI shieldingSTATS CHIPPAC PTE LTD·Filed 2022·Granted Sep 30, 2025·0 cites·17 claims
- 2573US10629565B2Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulantSTATS CHIPPAC PTE LTD·Filed 2019·Granted Apr 21, 2020·1 cites·22 claims
- 2672US12438099B2Semiconductor device and method of forming EMI shielding material in two-step process to avoid contaminating electrical connectorSTATS CHIPPAC PTE LTD·Filed 2022·Granted Oct 7, 2025·0 cites·25 claims
- 2772US11581233B2Semiconductor device and method of forming electrical circuit pattern within encapsulant of SIP moduleSTATS CHIPPAC PTE LTD·Filed 2021·Granted Feb 14, 2023·0 cites·25 claims
- 2872US2025273594A1Semiconductor Device and Method of Forming Multi-Layer Shielding Structure Over the Semiconductor DeviceSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 2969US11749668B2PSPI-based patterning method for RDLSTATS CHIPPAC PTE LTD·Filed 2021·Granted Sep 5, 2023·0 cites·21 claims
- 3067US12444694B2Semiconductor device and method of forming selective EMI shielding with slotted substrateSTATS CHIPPAC PTE LTD·Filed 2022·Granted Oct 14, 2025·0 cites·25 claims
- 3167US11450284B2Data driving circuit and display deviceLG DISPLAY CO LTD·Filed 2021·Granted Sep 20, 2022·0 cites·16 claims
- 3266US12322349B2Data driving circuit and display deviceLG DISPLAY CO LTD·Filed 2022·Granted Jun 3, 2025·0 cites·11 claims
- 3366US9171795B2Integrated circuit packaging system with embedded component and method of manufacture thereofJEON DONG JU·Filed 2014·Granted Oct 27, 2015·2 cites·20 claims
- 3464US10665662B2Semiconductor device and method of forming substrate including embedded component with symmetrical structureSTATS CHIPPAC PTE LTD·Filed 2019·Granted May 26, 2020·0 cites·21 claims
- 3562US12327799B2Semiconductor device and method of forming multi-layer shielding structure with layers of ferromagnetic material, protective material, laminate material or conductive material over the semiconductor deviceSTATS CHIPPAC PTE LTD·Filed 2021·Granted Jun 10, 2025·0 cites·2 claims
- 3662US2024332151A1Integrated package and method for making the sameSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 3762US2025343158A1Semiconductor Device and Method of Forming C2W Package with EMI ShieldingSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 3862US2024347477A1Method for forming a shielding layer over a semiconductor package with reduced metal burrsSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 3962US2024387309A1Electronic package and method for forming the sameSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 4062US2024339394A1Partially shielded semiconductor device and method for making the sameSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 4161US2025125158A1Method for attaching a heat spreader to a semiconductor package and semiconductor package assembliesSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 4261US2025218985A1Semiconductor Device and Method of Forming Selective Shielding Using UV Curable InkSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 4361US2024250062A1Semiconductor device and method for making the sameSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 4460US2024234270A1Semiconductor device and method for making the sameSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 4560US2024120291A1Semiconductor device and method for making the sameSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 4659US11652065B2Semiconductor device and method of embedding circuit pattern in encapsulant for SIP moduleSTATS CHIPPAC PTE LTD·Filed 2021·Granted May 16, 2023·0 cites·28 claims
- 4759US8975665B2Integrated circuit packaging system with coreless substrate and method of manufacture thereofJUNG JINHEE·Filed 2013·Granted Mar 10, 2015·2 cites·20 claims
- 4858US2024379580A1Semiconductor Device and Method of Forming Shielding Material Containing Conductive SpheresSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 4958US2024055368A1Semiconductor devices with pyramidal shielding and method for making the sameSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 5057US12444639B2Semiconductor device and method for reducing metal burrs using laser groovingSTATS CHIPPAC PTE LTD·Filed 2021·Granted Oct 14, 2025·0 cites·22 claims
Showing the top 50 of 55 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →