Inventor · disambiguated record
Jin-San Jung
Also filed as: JUNG JIN-SAN
5 granted patents·3 pending applications·18 citations·filing 2011–2021
70Inventor score
Top patents by PatentIndex Score
8 records- 0187US8641453B2Memory module and method of manufacturing a memory moduleJUNG JIN-SAN·Filed 2011·Granted Feb 4, 2014·14 cites·19 claims
- 0276US9313891B2Slot-mounted printed circuit board having small insertion forceJUNG JIN-SAN·Filed 2013·Granted Apr 12, 2016·4 cites·14 claims
- 0356US2014334108A1Semiconductor package module having self-assembled insulation thin film and method of manufacturing the semiconductor package moduleSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 0450US11456202B2Stage structure for semiconductor fabrication process, system of picking up semiconductor chip, and method of controlling tilting angle of pickup headSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 27, 2022·0 cites·16 claims
- 0550US11444070B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 13, 2022·0 cites·20 claims
- 0649US2011194260A1Semiconductor package module having self-assembled insulation thin film and method of manufacturing the semiconductor package moduleSAMSUNG ELECTRONICS CO LTD·Filed 2011·Application pending·0 cites
- 0742US2012318562A1Working panel and working panel set comprising array board patternsKIM KYU-TAE·Filed 2012·Application pending·0 cites
- 0839US8759189B2Reprocessing method of a semiconductor deviceJUNG JIN-SAN·Filed 2012·Granted Jun 24, 2014·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →