Inventor · disambiguated record
Jin Su Kim
Also filed as: KIM JIN SU
112 granted patents·44 pending applications·529 citations·filing 1998–2025
99Inventor score
Files withCORNING INC34SAMSUNG ELECTRONICS CO LTD31SAMSUNG ELECTRO MECH18LG INNOTEK CO LTD17SK HYNIX INC14
Top patents by PatentIndex Score
156 records- 0198US10727212B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 28, 2020·36 cites·32 claims
- 0297US10026668B1Passivation layer having an opening for under bump metallurgySAMSUNG ELECTRO MECH·Filed 2017·Granted Jul 17, 2018·26 cites·18 claims
- 0396US11697617B2Glass laminate with buried stress spikes to arrest cracks and methods of making the sameCORNING INC·Filed 2020·Granted Jul 11, 2023·4 cites·12 claims
- 0495US12326604B2Integrated circuit packages having electrical and optical connectivity and methods of making the sameCORNING INC·Filed 2024·Granted Jun 10, 2025·2 cites·22 claims
- 0594US11508575B2Low warp fan-out processing method and production of substrates thereforCORNING INC·Filed 2020·Granted Nov 22, 2022·3 cites·24 claims
- 0694US10253550B1Vacuum insulated glass units and methodology for manufacturing the sameCORNING INC·Filed 2016·Granted Apr 9, 2019·14 cites·13 claims
- 0793US10403579B2Semiconductor device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 3, 2019·8 cites·16 claims
- 0892US10457595B2Laser welded glass packagesCORNING INC·Filed 2015·Granted Oct 29, 2019·6 cites·9 claims
- 0992US10437145B2Method of detaching a pellicle from a photomaskSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 8, 2019·4 cites·4 claims
- 1090US12032216B2Integrated circuit packages having electrical and optical connectivity and methods of making the sameCORNING INC·Filed 2019·Granted Jul 9, 2024·6 cites·17 claims
- 1190US9733417B2Lighting device with light diffusing elementLG INNOTEK CO LTD·Filed 2015·Granted Aug 15, 2017·7 cites·21 claims
- 1290USD717255SSemiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 11, 2014·45 cites·1 claims
- 1389US10763217B2Semiconductor package and antenna module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 1, 2020·6 cites·21 claims
- 1489USD719113SSemiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 9, 2014·43 cites·1 claims
- 1588US9880462B2Pellicle and exposure mask including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 30, 2018·3 cites·15 claims
- 1687USD631464SCellular phoneLG ELECTRONICS INC·Filed 2010·Granted Jan 25, 2011·37 cites·1 claims
- 1786US10935199B2Lighting device having non-planar diffuser with array of 3D elementsLG INNOTEK CO LTD·Filed 2019·Granted Mar 2, 2021·3 cites·17 claims
- 1886US10347586B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Granted Jul 9, 2019·5 cites·24 claims
- 1985US10073210B2Light source module and lighting device having the sameLG INNOTEK CO LTD·Filed 2015·Granted Sep 11, 2018·5 cites·19 claims
- 2085USD719926SSemiconductor deviceSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 23, 2014·33 cites·1 claims
- 2185US7329365B2Etchant composition for indium oxide layer and etching method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 12, 2008·14 cites·7 claims
- 2284US10410961B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 10, 2019·4 cites·24 claims
- 2384US6188129B1Stacked semiconductor chip package having external terminal pads and stackable chips having a protection layerHYUNDAI ELECTRONICS IND·Filed 1998·Granted Feb 13, 2001·76 cites·16 claims
- 2483US11159722B2Method for processing image signal, image signal processor, and image sensor chipSK HYNIX INC·Filed 2019·Granted Oct 26, 2021·4 cites·17 claims
- 2583US10985127B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 20, 2021·3 cites·15 claims
- 2683US10379283B2Lighting device having diffuser with array of 3D elementsLG INNOTEK CO LTD·Filed 2017·Granted Aug 13, 2019·3 cites·23 claims
- 2782US10504825B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 10, 2019·4 cites·18 claims
- 2882US9158052B2Method for manufacturing a wire grid polarizerKIM JIN SU·Filed 2011·Granted Oct 13, 2015·4 cites·27 claims
- 2982US2024351312A1Glass laminates having determined stress profiles and methods of making the sameCORNING INC·Filed 2024·Application pending·0 cites
- 3081US11752500B2Microfluidic devices and methods for manufacturing microfluidic devicesCORNING INC·Filed 2019·Granted Sep 12, 2023·1 cites·11 claims
- 3181US11651476B2Noise removing circuit, image sensing device and operation method of the sameSK HYNIX INC·Filed 2021·Granted May 16, 2023·1 cites·17 claims
- 3281US10522497B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Dec 31, 2019·3 cites·26 claims
- 3380US10475748B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 12, 2019·3 cites·22 claims
- 3480US10312195B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Jun 4, 2019·3 cites·20 claims
- 3580US9766390B2Optical member having three-dimensional effect forming portion and multiple effect forming portion and lighting device using the sameLG INNOTEK CO LTD·Filed 2014·Granted Sep 19, 2017·5 cites·18 claims
- 3680US2023364606A1Microfluidic devices and methods for manufacturing microfluidic devicesCORNING INC·Filed 2023·Application pending·0 cites
- 3779US12043575B2Glass laminate with buried stress spikes to arrest cracks and methods of making the sameCORNING INC·Filed 2023·Granted Jul 23, 2024·0 cites·8 claims
- 3879US10567661B2Electronic apparatus and controlling method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 18, 2020·2 cites·12 claims
- 3979US2024400434A1Glass carriers for fan-out packaging having target coefficients of thermal expansion and methods for making the sameCORNING INC·Filed 2024·Application pending·0 cites
- 4078US11764117B2Hermetically sealed optically transparent wafer-level packages and methods for making the sameCORNING INC·Filed 2019·Granted Sep 19, 2023·2 cites·23 claims
- 4178US10338297B2Lighting device using line shaped beamLG INNOTEK CO LTD·Filed 2014·Granted Jul 2, 2019·4 cites·18 claims
- 4277US10163746B2Semiconductor package with improved signal stability and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Dec 25, 2018·3 cites·20 claims
- 4376US10453788B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 22, 2019·3 cites·25 claims
- 4475US11887282B2Noise removing circuit, image sensing device and operation method of the sameSK HYNIX INC·Filed 2023·Granted Jan 30, 2024·0 cites·14 claims
- 4575US9952376B2Lighting device using line shaped beamLG INNOTEK CO LTD·Filed 2014·Granted Apr 24, 2018·3 cites·19 claims
- 4674US11367665B2Precision structured glass articles, integrated circuit packages, optical devices, microfluidic devices, and methods for making the sameCORNING INC·Filed 2018·Granted Jun 21, 2022·2 cites·20 claims
- 4774US10475776B2Fan-out semiconductor package moduleSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 12, 2019·2 cites·28 claims
- 4873US11875993B2Low warp fan-out processing method and production of substrates thereforCORNING INC·Filed 2022·Granted Jan 16, 2024·0 cites·10 claims
- 4973US9732939B2Optical member and lighting device using the sameLG INNOTEK CO LTD·Filed 2014·Granted Aug 15, 2017·2 cites·16 claims
- 5072US12252437B2Anti-reflection and anti-glare glass laminatesCORNING INC·Filed 2021·Granted Mar 18, 2025·0 cites·20 claims
Showing the top 50 of 156 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →