Inventor · disambiguated record
Jin Yul Kim
Also filed as: KIM JIN HO · KIM JIN YUL
3 granted patents·1 pending application·3 citations·filing 2002–2020
56Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD3
Top patents by PatentIndex Score
4 records- 0181US10600748B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 24, 2020·3 cites·33 claims
- 0267US11011482B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 18, 2021·0 cites·15 claims
- 0355US10714437B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 14, 2020·0 cites·20 claims
- 0432US2003025190A1Tape ball grid array semiconductor chip package having ball land pad isolated from adhesive, a method of manufacturing the same and a multi-chip packageFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →