Inventor · disambiguated record
Jingu Kim
Also filed as: KIM JINGU
14 granted patents·10 pending applications·15 citations·filing 2010–2025
87Inventor score
Top patents by PatentIndex Score
24 records- 0194US11417613B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 16, 2022·4 cites·20 claims
- 0291US11735553B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 22, 2023·2 cites·20 claims
- 0390US11562939B2Semiconductor package including heat spreader layerSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 24, 2023·2 cites·20 claims
- 0480US11569563B2Semiconductor packages and method of manufacturing semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 31, 2023·1 cites·20 claims
- 0577US10281645B2Liquid crystal display deviceLG DISPLAY CO LTD·Filed 2016·Granted May 7, 2019·5 cites·14 claims
- 0677US2025046737A1Semiconductor package including antennaSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0776US12183694B2Semiconductor package including antennaSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 31, 2024·0 cites·20 claims
- 0875US12040248B2Semiconductor package including heat spreader layerSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 0975US2024347409A1Semiconductor package including heat spreader layerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1072US12040299B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 16, 2024·0 cites·20 claims
- 1168US11637079B2Semiconductor package including antennaSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 25, 2023·0 cites·19 claims
- 1265US11973042B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 30, 2024·0 cites·20 claims
- 1364US11942434B2Method of manufacturing a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 26, 2024·0 cites·18 claims
- 1462US12453107B2Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
- 1559US11342274B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 24, 2022·0 cites·18 claims
- 1657US8484253B2Variational mode seekingTHIESSON BO·Filed 2010·Granted Jul 9, 2013·1 cites·20 claims
- 1757US2024258277A1Semiconductor packages and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1857US2025014957A1Semiconductor package having increased reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1956US2024258276A1Semiconductor packages and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2055US2024213113A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2153US2024222284A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2253US2025336743A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2352US2023223353A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2435US2018124444A1Systems and methods of predicting consumption of original media items accesible via an internet-based media systemNETFLIX INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →