Inventor · disambiguated record
Jihwang Kim
Also filed as: KIM JIHWANG
14 granted patents·13 pending applications·5 citations·filing 2020–2025
84Inventor score
Files withSAMSUNG ELECTRONICS CO LTD27
Top patents by PatentIndex Score
27 records- 0194US12388029B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 12, 2025·3 cites·18 claims
- 0289US11367688B2Semiconductor package with interposerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 21, 2022·2 cites·20 claims
- 0378US12261157B2Semiconductor device having package on package structure and method of manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 0477US2025349746A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0574US2025201784A1Semiconductor device having package on package structure and method of manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0673US12334454B2Semiconductor package including molding layerSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·18 claims
- 0771US12021036B2Semiconductor package including interposer and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 25, 2024·0 cites·20 claims
- 0869US11804477B2Semiconductor device having package on package structure and method of manufacturing the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 31, 2023·0 cites·20 claims
- 0969US11798889B2Methods of manufacturing semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 24, 2023·0 cites·20 claims
- 1065US11817401B2Semiconductor package including molding layerSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 14, 2023·0 cites·20 claims
- 1164US11521934B2Semiconductor package including interposer and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 6, 2022·0 cites·19 claims
- 1260US2025210487A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1360US2025357442A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1459US12148729B2Semiconductor package structure having interposer substrate, and stacked semiconductor package structure including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 19, 2024·0 cites·19 claims
- 1558US2025062241A1Semiconductor package including a plurality of semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1658US2025201763A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1755US2024312974A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1855US2024186231A1Semiconductor package including a redistribution structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1955US2024321839A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2052US2024120280A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2151US11710673B2Interposer and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 2251US2023021867A1Semiconductor package including a lower substrate and an upper substrateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2351US2025253296A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2446US11676949B2Semiconductor packages having supporting membersSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·0 cites·20 claims
- 2546US11404382B2Semiconductor package including an embedded semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·18 claims
- 2644US11581263B2Semiconductor package, and package on package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 14, 2023·0 cites·20 claims
- 2743US2023063578A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →