Inventor · disambiguated record
Jia-Ling Ko
Also filed as: KO JIA-LING
2 granted patents·1 pending application·1 citations·filing 2018–2024
38Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD3
Top patents by PatentIndex Score
3 records- 0175US2024347506A1Method of forming package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0269US10672737B2Three-dimensional integrated circuit structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 2, 2020·1 cites·20 claims
- 0366US12051672B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 30, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →