Inventor · disambiguated record
Jieun Kwon
Also filed as: KWON JIEUN
2 granted patents·3 pending applications·0 citations·filing 2016–2023
26Inventor score
Top patents by PatentIndex Score
5 records- 0155US12444620B2Semiconductor device and method of forming SiP module absent substrateSTATS CHIPPAC PTE LTD·Filed 2022·Granted Oct 14, 2025·0 cites·28 claims
- 0254US2024234229A1Method for making a semiconductor device using a double side molding technologySTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 0338US2023230856A1Semiconductor device and method for making the sameSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 0435US2023402397A1Semiconductor Device and Method of Selective Shielding Using FOD MaterialSTATS CHIPPAC PTE LTD·Filed 2022·Application pending·0 cites
- 0530US10850083B2Method for manufacturing microneedle by using biocompatible polymerKWON JIEUN·Filed 2016·Granted Dec 1, 2020·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →