Inventor · disambiguated record
Jin-Yuan Lai
Also filed as: LAI JIN · LAI JIN YUAN
6 granted patents·1 pending application·17 citations·filing 2016–2024
74Inventor score
Files withADVANCED SEMICONDUCTOR ENG3LITE ON ELECTRONICS GUANGZHOU1LITE-ON ELECTRONICS (GUANGZHOU) CO LTD1MICRON TECHNOLOGY INC1UNIV CHINA PETROLEUM BEIJING1
Top patents by PatentIndex Score
7 records- 0189US10217649B2Semiconductor device package having an underfill barrierADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Feb 26, 2019·9 cites·20 claims
- 0288US10586716B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Mar 10, 2020·7 cites·21 claims
- 0361US11164756B2Semiconductor device package having continously formed tapered protrusionsADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 2, 2021·0 cites·18 claims
- 0461US9778712B2Method of integrating a server using alternating current power into a server system using direct current power and alternative junction device thereforLITE-ON ELECTRONICS (GUANGZHOU) CO LTD·Filed 2016·Granted Oct 3, 2017·1 cites·11 claims
- 0561US2025191993A1Semiconductor device assembly with thermally-conductive filler in an inter-die gapMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0653US11487045B2Method for recovering porosity evolution process of sequence stratigraphy of carbonate rocksUNIV CHINA PETROLEUM BEIJING·Filed 2022·Granted Nov 1, 2022·0 cites·6 claims
- 0734US10097177B2Switch device, control method of the same, and control method of transfer switch system using the sameLITE ON ELECTRONICS GUANGZHOU·Filed 2016·Granted Oct 9, 2018·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →