Inventor · disambiguated record
Jian-De Leu
Also filed as: LEU JIAN-DE
2 granted patents·1 pending application·3 citations·filing 2021–2021
38Inventor score
Files withORIENT SEMICONDUCTOR ELECTRONICS LTD3
Top patents by PatentIndex Score
3 records- 0185US11355356B1Manufacturing method of semiconductor package comprising heat spreaderORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2021·Granted Jun 7, 2022·3 cites·4 claims
- 0246US11462454B2Semiconductor package comprising heat spreader and manufacturing method thereofORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2021·Granted Oct 4, 2022·0 cites·6 claims
- 0339US2022285217A1Wafer thinning methodORIENT SEMICONDUCTOR ELECTRONICS LTD·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →