Inventor · disambiguated record
Jin Yoong Liong
Also filed as: LIONG JIN YOONG
2 granted patents·4 pending applications·0 citations·filing 2014–2023
27Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0155US10916485B2Molded wafer level packagingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Feb 9, 2021·0 cites·19 claims
- 0250US2025081647A1Image sensor packages and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 0349US10559510B2Molded wafer level packagingSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Feb 11, 2020·0 cites·17 claims
- 0449US2024332135A1Semiconductor package having wettable flanks and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 0536US2016104662A1Method and system for extending die size and packaged semiconductor devices incorporating the sameSEMICONDUCTOR COMPONENTS IND·Filed 2014·Application pending·0 cites
- 0634US2020035586A1Chip-on-lead semiconductor device packages with electrically isolated signal leadsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →