Inventor · disambiguated record
Jiun Dong Loeh
Also filed as: LOEH JIUN DONG
0 granted patents·4 pending applications·0 citations·filing 2023–2024
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0159US2024429196A1Selective wire coating during wire bondingWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 0255US2025385152A1Semiconductor device including an integrated wafer level heat sink window plateSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 0355US2025391732A1Semiconductor device including an integrated tim-on-dieSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 0453US2024397735A1Packaged memory device with overhang support structureWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →