Inventor · disambiguated record
Jin Lu
Also filed as: LU JIN · LU JIN-CHU
39 granted patents·11 pending applications·223 citations·filing 2002–2022
97Inventor score
Top patents by PatentIndex Score
50 records- 0195US9099132B1Systems and methods for multi-head separation determinationLSI CORP·Filed 2014·Granted Aug 4, 2015·25 cites·23 claims
- 0294US8837068B1Two dimensional magnetic recording servo system adaptive combinationLSI CORP·Filed 2014·Granted Sep 16, 2014·31 cites·20 claims
- 0393US9147416B2Systems and methods for multi-head servo data processingLSI CORP·Filed 2014·Granted Sep 29, 2015·18 cites·20 claims
- 0492US10567962B1Systems and methods for connecting internet-connected devices to wireless access pointsSYMANTEC CORP·Filed 2015·Granted Feb 18, 2020·9 cites·19 claims
- 0592US9572034B1Systems and methods for securing wireless networksSYMANTEC CORP·Filed 2015·Granted Feb 14, 2017·14 cites·20 claims
- 0690US9800610B1Systems and methods for defeating relay attacksSYMANTEC CORP·Filed 2015·Granted Oct 24, 2017·16 cites·20 claims
- 0789US9263459B1Capping poly channel pillars in stacked circuitsLI HONGQI·Filed 2014·Granted Feb 16, 2016·11 cites·18 claims
- 0884US9754825B2Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2015·Granted Sep 5, 2017·3 cites·19 claims
- 0984US9099442B2Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2013·Granted Aug 4, 2015·4 cites·21 claims
- 1084US7405169B2Composite materials and methods of making the sameROHM & HAAS·Filed 2006·Granted Jul 29, 2008·5 cites·10 claims
- 1182US7754612B2Methods and apparatuses for removing polysilicon from semiconductor workpiecesMICRON TECHNOLOGY INC·Filed 2007·Granted Jul 13, 2010·7 cites·30 claims
- 1281US8731115B2Systems and methods for data processing including pre-equalizer noise suppressionYANG SHAOHUA·Filed 2012·Granted May 20, 2014·5 cites·20 claims
- 1381US8630053B2Systems and methods for parameter modification during data processing retryYANG SHAOHUA·Filed 2012·Granted Jan 14, 2014·5 cites·20 claims
- 1479US9577192B2Method for forming a metal cap in a semiconductor memory deviceSONY CORP·Filed 2014·Granted Feb 21, 2017·3 cites·20 claims
- 1578US11152388B2Memory arrays and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 19, 2021·2 cites·6 claims
- 1678US10567387B1Systems and methods for managing computing device access to local area computer networksSYMANTEC CORP·Filed 2016·Granted Feb 18, 2020·7 cites·20 claims
- 1776US9911643B2Semiconductor constructions and methods of forming intersecting lines of materialMICRON TECHNOLOGY INC·Filed 2016·Granted Mar 6, 2018·2 cites·13 claims
- 1875US10546777B2Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Jan 28, 2020·1 cites·25 claims
- 1975US9922875B2Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Mar 20, 2018·1 cites·27 claims
- 2075US6659410B1Leg of a metallic tableFiled 2002·Granted Dec 9, 2003·24 cites·4 claims
- 2174US9613864B2Low capacitance interconnect structures and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2014·Granted Apr 4, 2017·3 cites·21 claims
- 2272US10516570B1Systems and methods for tagging client devicesSYMANTEC CORP·Filed 2017·Granted Dec 24, 2019·2 cites·20 claims
- 2371US11011420B2Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted May 18, 2021·0 cites·22 claims
- 2469US9252989B2Data-dependent equalizer circuitLSI CORP·Filed 2012·Granted Feb 2, 2016·2 cites·18 claims
- 2569US8911558B2Post-tungsten CMP cleaning solution and method of using the sameLI HONGQI·Filed 2011·Granted Dec 16, 2014·2 cites·7 claims
- 2665US11641742B2Memory arrays and methods used in forming a memory array comprising strings of memory cellsMICRON TECHNOLOGY INC·Filed 2021·Granted May 2, 2023·0 cites·16 claims
- 2765US8810949B2Equalization combining outputs of multiple component filtersLSI CORP·Filed 2012·Granted Aug 19, 2014·1 cites·20 claims
- 2863US8922934B2Systems and methods for transition based equalizationLSI CORP·Filed 2013·Granted Dec 30, 2014·1 cites·20 claims
- 2961US10403575B2Interconnect structure with nitrided barrierMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 3, 2019·1 cites·23 claims
- 3061US2024207252A1Aerosol-forming substrate and aerosol-generating systemSHENZHEN FIRST UNION TECH CO·Filed 2022·Application pending·0 cites
- 3160US10847442B2Interconnect assemblies with through-silicon vias and stress-relief featuresMICRON TECHNOLOGY INC·Filed 2014·Granted Nov 24, 2020·1 cites·17 claims
- 3260US8071480B2Method and apparatuses for removing polysilicon from semiconductor workpiecesLU JIN·Filed 2010·Granted Dec 6, 2011·1 cites·19 claims
- 3358US7108148B2Dustbin with two lids operated by a single pedalTIEH CHIN KUNG METAL INDUSTRY·Filed 2004·Granted Sep 19, 2006·16 cites·6 claims
- 3454US2020189802A1Cap structure for fragile bottleTIEH CHIN KUNG METAL IND CO LTD·Filed 2019·Application pending·0 cites
- 3553US9391001B2Semiconductor constructionsMICRON TECHNOLOGY INC·Filed 2013·Granted Jul 12, 2016·0 cites·16 claims
- 3650US9911653B2Low capacitance interconnect structures and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Mar 6, 2018·0 cites·21 claims
- 3749US2017133585A1Method for forming a metal cap in a semiconductor memory deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2017·Application pending·0 cites
- 3848US10319678B2Capping poly channel pillars in stacked circuitsINTEL CORP·Filed 2015·Granted Jun 11, 2019·0 cites·18 claims
- 3947US2005127627A1Multi deck cart easy to assemble by usersFiled 2003·Application pending·0 cites
- 4046US8810948B2Over-sampled signal equalizerLSI CORP·Filed 2012·Granted Aug 19, 2014·0 cites·20 claims
- 4142US10163655B2Through substrate via liner densificationMICRON TECHNOLOGY INC·Filed 2015·Granted Dec 25, 2018·0 cites·22 claims
- 4242US2023164987A13d nand memory cell with flat trap base profileINTEL CORP·Filed 2021·Application pending·0 cites
- 4341US9153451B2Method of forming a planar surface for a semiconductor device structure, and related methods of forming a semiconductor device structureMICRON TECHNOLOGY INC·Filed 2012·Granted Oct 6, 2015·0 cites·22 claims
- 4441US2011091316A1Fan assembly with snap-on coverFU ZHUN PRECISION IND SHENZHEN·Filed 2010·Application pending·0 cites
- 4539US7051567B2Method for folding and curving of a metallic plateTIEH CHIN KUNG METAL INDUSTRY·Filed 2004·Granted May 30, 2006·0 cites·2 claims
- 4639US2005023403A1Strap supporting post capable of automatically winding a strap around itFiled 2003·Application pending·0 cites
- 4737US2011127006A1Heat dissipation deviceFU ZHUN PRECISION IND SHENZHEN·Filed 2010·Application pending·0 cites
- 4837US2004118002A1Tape measureFiled 2002·Application pending·0 cites
- 4934US2013313718A1Substrates Comprising Integrated Circuitry, Methods Of Processing A Substrate Comprising Integrated Circuitry, And Methods Of Back-Side Thinning A Substrate Comprising Integrated CircuitryVARGHESE SONY·Filed 2012·Application pending·0 cites
- 5031US2013332790A1LDPC Decision Driven Equalizer AdaptationLU JIN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →