Inventor · disambiguated record
Jing-En Luan
Also filed as: LUAN JING-EN
55 granted patents·19 pending applications·169 citations·filing 2006–2025
98Inventor score
Files withST MICROELECTRONICS PTE LTD41STMICROELECTRONICS (SHENZHEN) R&D CO LTD10LUAN JING-EN8ST MICROELECTRONICS ASIA6GOH KIM-YONG4
Top patents by PatentIndex Score
74 records- 0195US8884422B2Flip-chip fan-out wafer level package for package-on-package applications, and method of manufactureGOH KIM-YONG·Filed 2009·Granted Nov 11, 2014·46 cites·8 claims
- 0294US9698105B2Electronic device with redistribution layer and stiffeners and related methodsST MICROELECTRONICS PTE LTD·Filed 2016·Granted Jul 4, 2017·10 cites·21 claims
- 0394US8890269B2Optical sensor package with through viasLUAN JING-EN·Filed 2012·Granted Nov 18, 2014·14 cites·17 claims
- 0491US8934052B2Camera module including an image sensor and a laterally adjacent surface mount device coupled at a lower surface of a dielectric material layerLUAN JING-EN·Filed 2010·Granted Jan 13, 2015·14 cites·13 claims
- 0589US11721657B2Wafer level chip scale package having varying thicknessesST MICROELECTRONICS PTE LTD·Filed 2020·Granted Aug 8, 2023·2 cites·20 claims
- 0686US12176220B2Optical sensor package and method of making an optical sensor packageST MICROELECTRONICS PTE LTD·Filed 2021·Granted Dec 24, 2024·1 cites·15 claims
- 0786US9645238B1Proximity sensor, electronic apparatus and method for manufacturing proximity sensorST MICROELECTRONICS PTE LTD·Filed 2015·Granted May 9, 2017·5 cites·23 claims
- 0886US8389335B2Chip Scale Package structure with can attachmentGOH KIM-YONG·Filed 2012·Granted Mar 5, 2013·7 cites·16 claims
- 0985US8466997B2Fan-out wafer level package for an optical sensor and method of manufacture thereofGOH KIM-YONG·Filed 2009·Granted Jun 18, 2013·8 cites·13 claims
- 1084US9768341B2Proximity detector device with interconnect layers and related methodsSTMICROELECTRONICS (SHENZHEN) R&D CO LTD·Filed 2014·Granted Sep 19, 2017·5 cites·20 claims
- 1183US9859196B2Electronic device with periphery contact pads surrounding central contact padsSTMICROELECTRONICS (SHENZHEN) R&D CO LTD·Filed 2016·Granted Jan 2, 2018·3 cites·39 claims
- 1283US9466550B2Electronic device with redistribution layer and stiffeners and related methodsST MICROELECTRONICS PTE LTD·Filed 2015·Granted Oct 11, 2016·3 cites·21 claims
- 1383US9385153B2Image sensor device with flexible interconnect layer and related methodsST MICROELECTRONICS PTE LTD·Filed 2015·Granted Jul 5, 2016·4 cites·24 claims
- 1482US10126462B2Proximity sensor, electronic apparatus and method for manufacturing proximity sensorST MICROELECTRONICS PTE LTD·Filed 2015·Granted Nov 13, 2018·2 cites·26 claims
- 1582US9455292B2Image sensing device with interconnect layer gapST MICROELECTRONICS PTE LTD·Filed 2015·Granted Sep 27, 2016·4 cites·24 claims
- 1681US8502367B2Wafer-level packaging method using composite material as a baseLUAN JING-EN·Filed 2010·Granted Aug 6, 2013·6 cites·18 claims
- 1781US8013438B2Semiconductor package with a stiffening member supporting a thermal heat spreaderST MICROELECTRONICS ASIA·Filed 2009·Granted Sep 6, 2011·10 cites·26 claims
- 1881US2025293190A1Wafer level chip scale package having varying thicknessesST MICROELECTRONICS PTE LTD·Filed 2025·Application pending·0 cites
- 1980US10038108B2Glue bleeding prevention cap for optical sensor packagesST MICROELECTRONICS PTE LTD·Filed 2016·Granted Jul 31, 2018·3 cites·23 claims
- 2080US2024282881A1Embedded wafer level optical sensor packagingST MICROELECTRONICS PTE LTD·Filed 2024·Application pending·0 cites
- 2179US12354986B2Wafer level chip scale package having varying thicknessesST MICROELECTRONICS PTE LTD·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 2278US9287227B2Electronic device with first and second contact pads and related methodsSTMICROELECTRONICS SHENZHEN R&D CO LTD·Filed 2014·Granted Mar 15, 2016·3 cites·26 claims
- 2376US2025316634A1Package with polymer pillars and raised portionsST MICROELECTRONICS PTE LTD·Filed 2025·Application pending·0 cites
- 2476US2025079189A1Optical sensor package and method of making an optical sensor packageST MICROELECTRONICS PTE LTD·Filed 2024·Application pending·0 cites
- 2575US11988743B2Molded proximity sensorST MICROELECTRONICS PTE LTD·Filed 2022·Granted May 21, 2024·0 cites·20 claims
- 2675US7956475B2Step cavity for enhanced drop test performance in ball grid array packageST MICROELECTRONICS ASIA·Filed 2008·Granted Jun 7, 2011·6 cites·14 claims
- 2775US2024036169A1Optical sensor package with encapsulant is between and separates substrates and multiple assembliesST MICROELECTRONICS PTE LTD·Filed 2023·Application pending·0 cites
- 2871US12002898B2Embedded wafer level optical sensor packagingST MICROELECTRONICS PTE LTD·Filed 2021·Granted Jun 4, 2024·0 cites·20 claims
- 2970US12266636B2Stacked die package including a multi-contact interconnectST MICROELECTRONICS PTE LTD·Filed 2021·Granted Apr 1, 2025·0 cites·20 claims
- 3069US12230619B2Low profile sensor packagesST MICROELECTRONICS PTE LTD·Filed 2022·Granted Feb 18, 2025·0 cites·19 claims
- 3169US9419047B2Image sensor device with aligned IR filter and dielectric layer and related methodsSTMICROELECTRONICS (SHENZHEN) R&D CO LTD·Filed 2013·Granted Aug 16, 2016·2 cites·24 claims
- 3269US9365415B2Compact electronic package with MEMS IC and related methodsSTMICROELECTRONICS SHENZHEN R&D CO LTD·Filed 2014·Granted Jun 14, 2016·2 cites·21 claims
- 3368US12494447B2Low cost wafer level packages and siliconST MICROELECTRONICS PTE LTD·Filed 2022·Granted Dec 9, 2025·0 cites·21 claims
- 3468US11828877B2Optical sensor package with encapsulant is between and separates substrates and multiple assembliesST MICROELECTRONICS PTE LTD·Filed 2020·Granted Nov 28, 2023·0 cites·20 claims
- 3568US8164179B2Chip scale package structure with can attachmentGOH KIM-YONG·Filed 2008·Granted Apr 24, 2012·3 cites·11 claims
- 3668US2025192111A1Stacked die package including a multi-contact interconnectST MICROELECTRONICS PTE LTD·Filed 2025·Application pending·0 cites
- 3767US9466557B2Electronic device with first and second contact pads and related methodsSTMICROELECTRONICS (SHENZHEN) R&D CO LTD·Filed 2015·Granted Oct 11, 2016·1 cites·24 claims
- 3867US2025174616A1Low profile sensor packagesST MICROELECTRONICS PTE LTD·Filed 2025·Application pending·0 cites
- 3965US10429509B2Molded proximity sensorST MICROELECTRONICS PTE LTD·Filed 2015·Granted Oct 1, 2019·1 cites·5 claims
- 4064US12368125B2Package with polymer pillars and raised portionsST MICROELECTRONICS PTE LTD·Filed 2021·Granted Jul 22, 2025·0 cites·20 claims
- 4164US10269583B2Semiconductor die attachment with embedded stud bumps in attachment materialST MICROELECTRONICS PTE LTD·Filed 2015·Granted Apr 23, 2019·1 cites·20 claims
- 4264US2025204066A1Optical sensor packaging and method of manufactureST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 4361US12183646B2Semiconductor device with a dielectric between portionsST MICROELECTRONICS PTE LTD·Filed 2023·Granted Dec 31, 2024·0 cites·20 claims
- 4461US9583666B2Wafer level packaging for proximity sensorST MICROELECTRONICS PTE LTD·Filed 2015·Granted Feb 28, 2017·1 cites·21 claims
- 4561US2024332143A1Hybrid quad flat no-leads (qfn) integrated circuit packageST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 4660US11513220B2Molded proximity sensorST MICROELECTRONICS PTE LTD·Filed 2019·Granted Nov 29, 2022·0 cites·20 claims
- 4760US9019636B2Lens alignment apparatus and methodLUAN JING-EN·Filed 2010·Granted Apr 28, 2015·1 cites·24 claims
- 4860US2024290807A1Substrateless chip scale optical sensor packageST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 4959US2024128203A1Chip size package and systemST MICROELECTRONICS PTE LTD·Filed 2023·Application pending·0 cites
- 5058US10326039B2Proximity detector device with interconnect layers and related methodsSTMICROELECTRONICS SHENZHEN R&D CO LTD·Filed 2018·Granted Jun 18, 2019·0 cites·17 claims
Showing the top 50 of 74 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →