Inventor · disambiguated record
Jiaxin Mei
Also filed as: MEI JIAXIN
1 granted patent·2 pending applications·0 citations·filing 2021–2024
8Inventor score
Top patents by PatentIndex Score
3 records- 0156US2025282611A1Micro-differential pressure sensor, packaging structure, testing method and electronic deviceMEMSENSING MICROSYSTEMS SUZHOU CHINA CO LTD·Filed 2024·Application pending·0 cites
- 0250US12092540B2Package structure for differential pressure sensor, and electronic deviceMEMSENSING MICROSYSTEMS SUZHOU CHINA CO LTD·Filed 2021·Granted Sep 17, 2024·0 cites·8 claims
- 0340US2025230035A1Microphone structure, packaging structure, and electronic apparatusMEMSENSING MICROSYSTEMS SUZHOU CHINA CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →