Inventor · disambiguated record
Jisoo Oh
Also filed as: OH JISOO
6 granted patents·7 pending applications·200 citations·filing 2001–2024
80Inventor score
Top patents by PatentIndex Score
13 records- 0194US9806166B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 31, 2017·12 cites·20 claims
- 0291US6498421B1Ultrasonic drilling device with arc-shaped probeAMEGA LAB L L C·Filed 2001·Granted Dec 24, 2002·184 cites·8 claims
- 0386US10186457B2Methods of fabricating semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 22, 2019·4 cites·7 claims
- 0460US2025167111A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0560US2025192041A1Wiring structures and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0660US2025192042A1Integrated circuit device including a metal wiring layerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0760US2025070021A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0859US2024392192A1Etching gas composition and method of manufacturing integrated circuit device by using the sameSEMES CO LTD·Filed 2024·Application pending·0 cites
- 0959US2024392191A1Etching gas composition and method of manufacturing integrated circuit device using the sameSEMES CO LTD·Filed 2024·Application pending·0 cites
- 1058US10522401B2Methods of fabricating semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 31, 2019·0 cites·20 claims
- 1157US2025120140A1Integrated circuit devicesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1248US9806168B2Semiconductor devices and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 31, 2017·0 cites·19 claims
- 1344US10043889B2Semiconductor devicesSEONG GEUMJUNG·Filed 2017·Granted Aug 7, 2018·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →