Inventor · disambiguated record

Ji-Tae Ok

Also filed as: OK JI-TAE

1 granted patent·1 pending application·9 citations·filing 2007–2011

32Inventor score

Technology areasB03C H10W

Files withOK JI-TAE1 SAMSUNG TECHWIN CO LTD1

Top patents by PatentIndex Score

2 records

0166US7886796B2Chip bonding tool and related apparatus and methodSAMSUNG TECHWIN CO LTD·Filed 2007·Granted Feb 15, 2011·9 cites·15 claims
0221US2013126436A1Stirring apparatusOK JI-TAE·Filed 2011·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →