Inventor · disambiguated record
Ji Man Ryu
Also filed as: RYU JI MAN
8 granted patents·7 pending applications·13 citations·filing 2009–2024
79Inventor score
Top patents by PatentIndex Score
15 records- 0181US10147533B2InductorSAMSUNG ELECTRO MECH·Filed 2016·Granted Dec 4, 2018·2 cites·20 claims
- 0280US9793741B2Magnetic sheet, wireless charging sheet and method for manufacturing magnetic sheetSAMSUNG ELECTRO MECH·Filed 2014·Granted Oct 17, 2017·4 cites·16 claims
- 0377US10984942B2Coil componentSAMSUNG ELECTRO MECH·Filed 2018·Granted Apr 20, 2021·1 cites·15 claims
- 0468US8786064B2Semiconductor package and method for manufacturing the same and semiconductor package module having the sameKIM JIN SU·Filed 2012·Granted Jul 22, 2014·3 cites·20 claims
- 0564US9391363B2Multilayer ferrite sheet, antenna device using the same, and manufacturing method thereofSAMSUNG ELECTRO MACHANICS CO LTD·Filed 2013·Granted Jul 12, 2016·3 cites·17 claims
- 0659US11721473B2Coil componentSAMSUNG ELECTRO MECH·Filed 2019·Granted Aug 8, 2023·0 cites·19 claims
- 0759US2023360841A1Coil componentSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 0859US2025240511A13d scanning and appearance inspection apparatus for cylindrical secondary batteryEnscape co ltd·Filed 2024·Application pending·0 cites
- 0957US11830655B2Coil componentSAMSUNG ELECTRO MECH·Filed 2020·Granted Nov 28, 2023·0 cites·20 claims
- 1054US2024221994A1Coiil componentSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 1151US9088068B2Magnetic composite sheet and electromagnetic induction moduleSAMSUNG ELECTRO MECH·Filed 2013·Granted Jul 21, 2015·0 cites·12 claims
- 1245US2014145807A1Magnetic sheet of contactless power transmission deviceSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1341US2011056593A1Flaky Powder for an Electromagnetic Wave Absorber, and Method for Producing SameIUCF HYU·Filed 2009·Application pending·0 cites
- 1440US2014145512A1Contactless power transmission device and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1536US2012127681A1Soldering connecting pin, semiconductor package substrate and method of mounting semiconductor chip using the sameRYU JI MAN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →