Inventor · disambiguated record
Jiraporn Seangatith
Also filed as: SEANGATITH JIRAPORN
2 granted patents·7 pending applications·3 citations·filing 2012–2024
47Inventor score
Top patents by PatentIndex Score
9 records- 0172US9659899B2Die warpage control for thin die assemblyINTEL CORP·Filed 2015·Granted May 23, 2017·2 cites·20 claims
- 0258US2025300129A1Integrated circuit packages including multi-die stacks having tapered sidewallsINTEL CORP·Filed 2024·Application pending·0 cites
- 0354US9123732B2Die warpage control for thin die assemblySANE SANDEEP B·Filed 2012·Granted Sep 1, 2015·1 cites·16 claims
- 0453US2023285999A1Dual feed cold spray nozzle with separate temperature and feeding rate controlINTEL CORP·Filed 2022·Application pending·0 cites
- 0551US2024063091A1Thermally enhanced structural member and/or bond layer for multichip composite devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 0651US2024063072A1Laser assisted etching of dielectrics in ic devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 0750US2024061194A1Photonic quasi-monolithic die architecturesINTEL CORP·Filed 2022·Application pending·0 cites
- 0850US2024063180A1Ic die composites with inorganic inter-die fill structuresINTEL CORP·Filed 2022·Application pending·0 cites
- 0948US2024063142A1Die crack mitigation in multi-chip composite ic structuresINTEL CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →