Inventor · disambiguated record
Jian-Yu Shih
Also filed as: SHIH JIAN-YU
3 granted patents·12 pending applications·2 citations·filing 2012–2024
49Inventor score
Top patents by PatentIndex Score
15 records- 0162US2025253608A1Multi-layer composite heat dissipation substrateTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 0258US2025142730A1Power component submount and manufacturing method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 0353US8766734B2Through silicon via-based oscillator wafer-level-package structure and method for fabricating the sameCHANG CHI-CHUNG·Filed 2012·Granted Jul 1, 2014·2 cites·18 claims
- 0453US2024365473A1Method for manufacturing conductive circuit board and conductive circuit board made therefromTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 0553US2025074830A1Ceramic substrate and method for manufacturing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 0652US2025351265A1High reliability ceramic circuit board and method for producing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 0751US2025107299A1Light emitting diode package structure and method for manufacturing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 0848US2024304461A1Ceramic submount for semiconductor device and method for manufacturing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 0948US2024363482A1Ceramic metal composite substrateTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 1046US12432852B2Circuit board structure with embedded ceramic substrate and manufacturing process thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Sep 30, 2025·0 cites·10 claims
- 1144US12500092B2Chip package structure and method for fabricating the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2022·Granted Dec 16, 2025·0 cites·7 claims
- 1243US2024284592A1Printed circuit board and method for making the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 1343US2024363479A1Ceramic metal composite substrateTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 1443US2024276650A1Circuit board and manufacturing method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 1541US2024032204A1Method for manufacturing conductive circuit board and conductive circuit board made therefromTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →